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MMSZ4XXXET3

更新时间： 2024-11-02 03:10:03
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
5页 73K
描述
Zener Voltage Regulators 500 mW SOD−123 Surface Mount

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MMSZ4XXXET3 数据手册

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MMSZ4678ET1 Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
• 500 mW Rating on FR−4 or FR−5 Board  
1
2
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (>16 kV) per Human Body Model  
• Peak Power − 225 W (8 x 20 ms)  
Cathode  
Anode  
SOD−123  
CASE 425  
STYLE 1  
2
• Pb−Free Packages are Available  
1
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
MARKING DIAGRAM  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xxx M G  
1
G
MAXIMUM RATINGS  
xxx = Device Code (Refer to page 2)  
Rating  
Symbol  
Max  
Unit  
M
= Date Code  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Peak Power Dissipation @ 20 ms (Note 1)  
P
225  
W
pk  
@ T ≤ 25°C  
L
Total Power Dissipation on FR−5 Board,  
P
D
(Note 2) @ T = 75°C  
Derated above 75°C  
500  
6.7  
mW  
mW/°C  
ORDERING INFORMATION  
L
†
Device  
Package  
Shipping  
Thermal Resistance, (Note 3)  
Junction−to−Ambient  
R
340  
°C/W  
°C/W  
°C  
q
JA  
MMSZ4xxxET1  
SOD−123  
3000/Tape & Reel  
3000/Tape & Reel  
Thermal Resistance, (Note 3)  
Junction−to−Lead  
R
q
JL  
150  
MMSZ4xxxET1G SOD−123  
(Pb−Free)  
Junction and Storage Temperature Range  
T , T  
J
−55 to  
+150  
stg  
MMSZ4xxxET3  
SOD−123 10000/Tape & Reel  
MMSZ4xxxET3G SOD−123 10000/Tape & Reel  
(Pb−Free)  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. Nonrepetitive current pulse per Figure 11.  
2. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.  
3. Thermal Resistance measurement obtained via infrared Scan Method.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
Devices listed in bold, italic are ON Semiconductor  
Preferred devices. Preferred devices are recommended  
choices for future use and best overall value.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 4  
MMSZ4678ET1/D  
 
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