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MMSZ51T1 PDF预览

MMSZ51T1

更新时间: 2024-11-23 22:46:07
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
6页 77K
描述
Zener Voltage Regulators

MMSZ51T1 数据手册

 浏览型号MMSZ51T1的Datasheet PDF文件第2页浏览型号MMSZ51T1的Datasheet PDF文件第3页浏览型号MMSZ51T1的Datasheet PDF文件第4页浏览型号MMSZ51T1的Datasheet PDF文件第5页浏览型号MMSZ51T1的Datasheet PDF文件第6页 
MMSZ2V4T1 Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
500 mW Rating on FR−4 or FR−5 Board  
1
2
Wide Zener Reverse Voltage Range − 2.4 V to 56 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Pb−Free Package is Available  
Cathode  
Anode  
2
Mechanical Characteristics  
1
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily Solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
SOD−123  
CASE 425  
STYLE 1  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
MARKING DIAGRAM  
xx M  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
Total Power Dissipation on FR−5 Board,  
P
D
xx = Specific Device Code  
500  
6.7  
mW  
mW/°C  
(Note 1) @ T = 75°C  
L
M
= Date Code  
Derated above 75°C  
Thermal Resistance −  
Junction−to−Ambient (Note 2)  
R
340  
150  
°C/W  
°C/W  
°C  
q
JA  
ORDERING INFORMATION  
Thermal Resistance −  
Junction−to−Lead (Note 2)  
R
q
JL  
Device  
Package  
Shipping  
Junction and Storage  
Temperature Range  
T , T  
J
−55 to  
+150  
MMSZxxxT1  
MMSZxxxT3*  
SOD−123  
3000/Tape & Reel  
stg  
SOD−123 10,000/Tape & Reel  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. FR−5 = 3.5 X 1.5 inches.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
Individual devices are listed on page 3 of this data sheet.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 − Rev. 5  
MMSZ2V4T1/D  
 

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