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MMBT2222A PDF预览

MMBT2222A

更新时间: 2024-09-14 22:51:11
品牌 Logo 应用领域
美微科 - MCC 晶体放大器晶体管开关光电二极管IOT
页数 文件大小 规格书
3页 102K
描述
NPN General Purpose Amplifier

MMBT2222A 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:SOT-23包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.02
最大集电极电流 (IC):0.6 A集电极-发射极最大电压:40 V
配置:SINGLE最小直流电流增益 (hFE):40
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:NPN
认证状态:Not Qualified表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):300 MHz最大关闭时间(toff):285 ns
最大开启时间(吨):35 nsBase Number Matches:1

MMBT2222A 数据手册

 浏览型号MMBT2222A的Datasheet PDF文件第2页浏览型号MMBT2222A的Datasheet PDF文件第3页 
M C C  
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MMBT2222A  
Features  
·
·
Surface Mount SOT-23 Package  
Capable of 350mWatts of Power Dissipation  
NPN General  
C
Purpose Amplifier  
Pin Configuration  
Top View  
1 P  
B
E
Electrical Characteristics @ 25°C Unless Otherwise Specified  
SOT-23  
Symbol  
Parameter  
Min  
Max  
Units  
A
OFF CHARACTERISTICS  
D
V(BR)CEO  
V(BR)CBO  
V(BR)EBO  
IBL  
Collector-Emitter Breakdown Voltage*  
(IC=10mAdc, IB=0)  
40  
75  
Vdc  
Vdc  
Collector-Base Breakdown Voltage  
(IC=10mAdc, IE=0)  
Emitter-Base Breakdown Voltage  
(IE=10mAdc, IC=0)  
B
C
6.0  
Vdc  
F
E
Base Cutoff Current  
20  
10  
nAdc  
nAdc  
(VCE=60Vdc, VBE=3.0Vdc)  
Collector Cutoff Current  
(VCE=60Vdc, VBE=3.0Vdc)  
ICEX  
H
G
J
ON CHARACTERISTICS  
hFE  
DC Current Gain*  
K
(IC=0.1mAdc, VCE=10Vdc)  
(IC=1.0mAdc, VCE=10Vdc)  
(IC=10mAdc, VCE=10Vdc)  
(IC=150mAdc, VCE=10Vdc)  
(IC=150mAdc, VCE=1.0Vdc)  
(IC=500mAdc, VCE=10Vdc)  
Collector-Emitter Saturation Voltage  
(IC=150mAdc, IB=15mAdc)  
(IC=500mAdc, IB=50mAdc)  
Base-Emitter Saturation Voltage  
(IC=150mAdc, IB=15mAdc)  
(IC=500mAdc, IB=50mAdc)  
35  
50  
75  
100  
50  
40  
DIMENSIONS  
MM  
INCHES  
MIN  
300  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
NOTE  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
VCE(sat)  
0.3  
1.0  
Vdc  
Vdc  
F
G
H
J
VBE(sat)  
0.6  
1.2  
2.0  
.085  
.37  
K
SMALL-SIGNAL CHARACTERISTICS  
Suggested Solder  
Pad Layout  
fT  
Current Gain-Bandwidth Product  
(IC=20mAdc, VCE=20Vdc, f=100MHz)  
300  
MHz  
pF  
Cobo  
Cibo  
NF  
Output Capacitance  
(VCB=10Vdec, IE=0, f=1.0MHz)  
Input Capacitance  
(VBE=0.5Vdc, IC=0, f=1.0MHz)  
Noise Figure  
.031  
.800  
8.0  
25  
.035  
.900  
pF  
.079  
2.000  
inches  
mm  
4.0  
dB  
(IC=100mAdc, VCE=10Vdc, RS=1.0kW  
f=1.0kHz)  
SWITCHING CHARACTERISTICS  
td  
tr  
Delay Time  
Rise Time  
Storage Time  
Fall Time  
(VCC=30Vdc, VBE=0.5Vdc  
IC=150mAdc, IB1=15mAdc)  
(VCC=30Vdc, IC=150mAdc  
IB1=IB2=15mAdc)  
10  
25  
225  
60  
ns  
ns  
ns  
ns  
.037  
.950  
ts  
tf  
.037  
.950  
*Pulse Width £ 300ms, Duty Cycle£ 2.0%  
www.mccsemi.com  

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