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MM74HCT533J/A+ PDF预览

MM74HCT533J/A+

更新时间: 2024-11-20 14:30:27
品牌 Logo 应用领域
德州仪器 - TI 逻辑集成电路
页数 文件大小 规格书
5页 156K
描述
IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,CERAMIC

MM74HCT533J/A+ 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP20,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-XDIP-T20
JESD-609代码:e0逻辑集成电路类型:D LATCH
位数:8功能数量:1
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
封装主体材料:CERAMIC封装代码:DIP
封装等效代码:DIP20,.3封装形状:RECTANGULAR
封装形式:IN-LINE电源:5 V
子类别:FF/Latches标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUALBase Number Matches:1

MM74HCT533J/A+ 数据手册

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