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MM74HCT158J/A+ PDF预览

MM74HCT158J/A+

更新时间: 2024-11-28 04:51:31
品牌 Logo 应用领域
德州仪器 - TI 输入元件逻辑集成电路
页数 文件大小 规格书
4页 105K
描述
IC,LOGIC MUX,QUAD,2-INPUT,HCT-CMOS,DIP,16PIN,CERAMIC

MM74HCT158J/A+ 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP16,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-XDIP-T16
JESD-609代码:e0逻辑集成电路类型:MULTIPLEXER
功能数量:4输入次数:2
端子数量:16最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:CERAMIC
封装代码:DIP封装等效代码:DIP16,.3
封装形状:RECTANGULAR封装形式:IN-LINE
电源:5 V子类别:Multiplexer/Demultiplexers
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL

MM74HCT158J/A+ 数据手册

 浏览型号MM74HCT158J/A+的Datasheet PDF文件第2页浏览型号MM74HCT158J/A+的Datasheet PDF文件第3页浏览型号MM74HCT158J/A+的Datasheet PDF文件第4页 
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