DATA SHEET
www.onsemi.com
Quad 2-Input NAND Gate
MM74HC00
14
14
1
1
SOIC−14 NB,
CASE 751A−0.3
TSSOP−14,
CASE 948G−01
General Description
The MM74HC00 NAND gates utilize advanced silicon−gate
CMOS technology to achieve operating speeds similar to LS−TTL
gates with the low power consumption of standard CMOS integrated
circuits. All gates have buffered outputs. All devices have high noise
immunity and the ability to drive 10 LS−TTL loads. The 74HC logic
family is functionally as well as pin−out compatible with the standard
74LS logic family. All inputs are protected from damage due to static
MARKING DIAGRAM
14
14
HC
HC00A
00A
AWLYWW
ALYW
G
G
discharge by internal diode clamps to V and ground.
CC
1
1
Features
• Typical Propagation Delay: 8 ns
• Wide Power Supply Range: 2 V–6 V
• Low Quiescent Current: 20 mA Maximum (74HC Series)
• Low Input Current: 1 mA Maximum
• Fanout of 10 LS−TTL Loads
HC00A
A
WL, L
Y
WW, YW = Work Week
G
= Specific Device Code
= Assembly Location
= Wafer Lot Number
= Year
= Pb−Free Package
• This Device is Pb−Free and Halide Free
(Note: Microdot may be in either location)
ABSOLUTE MAXIMUM RATINGS (Note 1)
CONNECTION DIAGRAM
Symbol
Parameter
Supply Voltage
Rating
Unit
V
Pin Assignment for SOIC and TSSOP
V
CC
−0.5 to +7.0
V
IN
DC Input Voltage
−0.5 to V +0.5
V
CC
V
OUT
DC Output Voltage
−0.5 to V +0.5
V
CC
I , I
Clamp Diode Current
DC Output Current, per pin
20
25
50
mA
mA
mA
IK OK
I
OUT
I
DC V or GND Current,
CC
CC
per pin
T
Storage Temperature Range
Power Dissipation (Note 2)
S.O. Package only
−65 to +150
600
°C
STG
P
mW
D
LOGIC DIAGRAM
500
T
L
Lead Temperature
(Soldering 10 seconds)
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating − plastic “N” package: –12 mW/°C
from 65°C to 85°C.
ORDERING INFORMATION
See detailed ordering and shipping information on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 1983
1
Publication Order Number:
October, 2022 − Rev. 2
MM74HC00/D