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MECT-115-01-M-D-RA1-TR PDF预览

MECT-115-01-M-D-RA1-TR

更新时间: 2024-10-29 20:46:11
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 721K
描述
Card Edge Connector, 30 Contact(s), 2 Row(s), Female, Right Angle, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

MECT-115-01-M-D-RA1-TR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.40Factory Lead Time:8 weeks
风险等级:5.77板上安装选件:PEG
主体宽度:0.205 inch主体深度:0.291 inch
主体长度:0.591 inch连接器类型:CARD EDGE CONNECTOR
联系完成配合:GOLD (15) OVER NICKEL (100)联系完成终止:Tin (Sn) - with Nickel (Ni) barrier
触点性别:FEMALE触点材料:PHOSPHOR BRONZE
触点模式:STAGGERED触点样式:BELLOWED TYPE
DIN 符合性:NO滤波功能:NO
IEC 符合性:NO绝缘体颜色:BLACK
绝缘体材料:LIQUID CRYSTAL POLYMER (LCP)JESD-609代码:e3
MIL 符合性:NO插接触点节距:0.031 inch
混合触点:NO安装选项1:LOCKING
安装方式:RIGHT ANGLE安装类型:BOARD
连接器数:ONEPCB行数:2
装载的行数:2最高工作温度:125 °C
最低工作温度:-55 °C选件:GENERAL PURPOSE
PCB接触模式:STAGGEREDPCB触点行间距:8.2042 mm
电镀厚度:15u inch额定电流(信号):2 A
参考标准:UL可靠性:COMMERCIAL
子类别:Headers and Edge Type Connectors端子节距:0.8 mm
端接类型:SURFACE MOUNT触点总数:30
Base Number Matches:1

MECT-115-01-M-D-RA1-TR 数据手册

  
F-213  
MECT–110–01–M–D–RA1  
MECT–135–01–M–D–RA1  
MECT–115–01–M–D–RA1  
(0,80 mm) .0315"  
MECT SERIES  
SFP & SFP+ TRANSCEIVER INTERFACES  
2x10 position for  
Small Form Factor  
Mates with:  
SPECIFICATIONS  
SFP, SFP+, XFP or  
Pluggable (SFP & SFP+)  
XENPAK transceivers  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?MECT  
Fiber Optic Transceivers  
Insulator Material:  
Black LCP  
Contact Material:  
Phosphor Bronze  
Plating:  
Sn or Au over  
100µ" (2,54 µm) Ni  
Operating Temp Range:  
-55°C to +125°C  
Current Rating:  
2A per contact  
@ 80°C ambient  
(see website for details)  
Voltage Rating:  
265 VAC  
Alignment  
Pin  
2x10, 2x15 and  
2x35 position for  
XENPAK and XFP  
Transceivers  
RoHS Compliant:  
Yes  
Choice of  
three standard  
pin counts  
Processing:  
Lead–Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0,10 mm) .004" max (10-35)  
CARD  
THICKNESS  
PLATING  
OPTION  
OTHER  
OPTION  
POSITIONS  
PER ROW  
1
MECT  
D
RA1  
01  
–TR  
= (1 mm) .039"  
thick board  
= Tape & Reel  
Packaging  
–M  
10, 15, 35  
= 15µ" (0,38 µm) Gold on contact,  
Matte Tin on tail  
No. of Positions x (0,80) .0315 + (3,00) .118  
APPLICATION  
(7,40)  
.291  
MECT  
02  
01  
(0,80)  
.0315  
Press Fit, Solder Tail  
or PCI Press Fit Cage  
SFPC  
(1,20)  
.047  
No. of Positions x (0,80) .0315 + (1,40) .055  
(5,20)  
.205 (2,65)  
.104  
Transceiver or Patch Cable  
(3,25)  
.128  
(1,40)  
.055  
(0,90)  
.035  
(1,40)  
.055  
DIA  
x
DIA  
(0,95)  
.037  
(1,05)  
.041  
(9,10)  
.358  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
WWW.SAMTEC.COM  

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