Preliminary
MD16R1624(8/G)AF0
MD18R1624(8/G)AF0
32 Bit RIMM® Module
Overview
Key Timing Parameters
®
T h e 3 2 b i t R I M M module is a general purpose high-perfor-
The following table lists the frequency and latency bins
a v a i l a b l e f o r 3 2 b i t R I M M m o d u l e s .
mance line of memory modules suitable for use in a broad
range of applications including computer memory, personal
computers, workstations, and other applications where high
bandwidth and low latency are required.
Table 1: 32 bit RIMM Module Frequency and Latency
T h e 3 2 b i t R I M M m o d u l e c o n s i s t s o f 2 5 6 M b / 2 8 8 M b
R D R A M devices. These are extremely high-speed CMOS
S p e e d
®
t
D R A M s o r g a n i z e d a s 1 6 M w o r d s b y 1 6 o r 1 8 b i t s . T h e u s e
o f R a m b u s S i g n a l i n g L e v e l ( R S L ) t e c h n o l o g y p e r m i t s t h e
use of conventional system and board design technologies.
R I M M 3 2 0 0 m o d u l e s s u p p o r t 8 0 0 M H z t r a n s f e r r a t e p e r p i n ,
resulting in total module bandwidth of 3200MB/s or
3 . 2 G B / s . R I M M 4 2 0 0 m o d u l e s s u p p o r t 1 0 6 6 M H z t r a n s f e r
rate per pin, resulting in total module bandwidth of
4 2 0 0 M B / s o r 4 . 2 G B / s .
RAC
O r g a n i -
( R o w
A c c e s s
T i m e )
n s
P a r t N u m b e r
I / O F r e q .
( M H z )
z a t i o n
32
35
32
35
32
35
M D 1 6 / 1 8 R 1 6 2 4 A F 0 - C N 9
M D 1 6 / 1 8 R 1 6 2 4 A F 0 - C M 9
M D 1 6 / 1 8 R 1 6 2 8 A F 0 - C N 9
M D 1 6 / 1 8 R 1 6 2 8 A F 0 - C M 9
M D 1 6 / 1 8 R 1 6 2 G A F 0 - C N 9
M D 1 6 / 1 8 R 1 6 2 G A F 0 - C M 9
3 2 M
x
1 0 6 6 M H z
1 0 6 6 M H z
1 0 6 6 M H z
3 2 / 3 6
T h e 3 2 b i t R I M M m o d u l e p r o v i d e s t w o i n d e p e n d e n t 1 6 o r 1 8
bit memory channels to facilitate compact system design.
The "Thru" Channel enters and exits the module to support a
connection to or from a controller, memory slot, or termina-
t i o n . T h e " T e r m " C h a n n e l i s t e r m i n a t e d o n t h e m o d u l e a n d
supports a connection from a controller or another memory
slot.
6 4 M
x
R I M M 4 2 0 0
3 2 / 3 6
1 2 8 M
3 2 / 3 6
x
3 2 M
x
M D 1 6 / 1 8 R 1 6 2 4 A F 0 - C M 8
M D 1 6 / 1 8 R 1 6 2 8 A F 0 - C M 8
M D 1 6 / 1 8 R 1 6 2 G A F 0 - C M 8
3 2 / 3 6
T h e R D R A M a r c h i t e c t u r e e n a b l e s t h e h i g h e s t s u s t a i n e d
bandwidth for multiple, simultaneous, randomly addressed
memory transactions. The separate control and data buses
w i t h i n d e p e n d e n t r o w a n d c o l u m n c o n t r o l y i e l d o v e r 9 5 %
bus efficiency. The RDRAM device multi-bank architecture
supports up to four simultaneous transactions per device.
6 4 M
x
R I M M 3 2 0 0
8 0 0 M H z
40
3 2 / 3 6
1 2 8 M
3 2 / 3 6
x
Features
¨
2 I n d e p e n d e n t R D R A M c h a n n e l s , 1 p a s s t h r o u g h a n d 1
t e r m i n a t e d o n 3 2 b i t R I M M m o d u l e
Form Factor
¨
¨
¨
H i g h s p e e d 8 0 0 a n d 1 0 6 6 M H z R D R A M d e v i c e s
2 3 2 e d g e c o n n e c t o r p a d s w i t h 1 m m p a d s p a c i n g
M o d u l e P C B s i z e : 1 3 3 . 3 5 m m x 3 4 . 9 3 m m x 1 . 2 7 m m
(5. 25” x 1. 375” x 0. 05” )
T h e 3 2 b i t R I M M m o d u l e s a r e o f f e r e d i n 2 3 2 - p a d 1 m m e d g e
c o n n e c t o r p a d p i t c h s u i t a b l e f o r 2 3 2 c o n t a c t R I M M c o n n e c -
t ors.
¨
¨
¨
¨
¨
Gold plated edge connector pad contacts
Serial Presence Detect (SPD) support
Operates from a 2. 5 volt supply (±5 % )
L o w p o w e r a n d p o w e r d o w n s e l f r e f r e s h m o d e s
S e p a r a t e R o w a n d C o l u m n b u s e s f o r h i g h e r e f f i c i e n c y
Figure 1 : 32 bit RIMM module with heat spreader
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Version 1.0 July 2002