是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | WAFER | 包装说明: | DIE, |
针数: | 6 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
JESD-30 代码: | R-XUUC-N6 | JESD-609代码: | e3 |
功能数量: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | DIE |
封装形状: | RECTANGULAR | 封装形式: | UNCASED CHIP |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
表面贴装: | YES | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | MATTE TIN |
端子形式: | NO LEAD | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | 40 | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCRF355 | MICROCHIP |
获取价格 |
13.56 MHz Passive RFID Device with Anti-Collision Feature | |
MCRF355/S | MICROCHIP |
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SPECIALTY TELECOM CIRCUIT, UUC6, 0.008 INCH, DIE-6 | |
MCRF355/SB | MICROCHIP |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC6, 0.008 INCH, BUMP, DIE-6 | |
MCRF355/SNQ11 | MICROCHIP |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | |
MCRF355/SQ11 | MICROCHIP |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC6, 0.008 INCH, DIE-6 | |
MCRF355/W | MICROCHIP |
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SPECIALTY TELECOM CIRCUIT, UUC6, 0.011 INCH, BACKGRIND DIE-6 | |
MCRF355/WB | MICROCHIP |
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SPECIALTY TELECOM CIRCUIT, UUC6, 0.008 INCH, BACKGRIND, BUMP, WAFER-6 | |
MCRF355/WF | MICROCHIP |
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SPECIALTY TELECOM CIRCUIT, UUC6, 0.008 INCH, BACKGRIND DIE-6 | |
MCRF355/WFQ11 | MICROCHIP |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC6, 0.008 INCH, BACKGRIND DIE-6 | |
MCRF355/WQ11 | MICROCHIP |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC6, 0.011 INCH, BACKGRIND DIE-6 |