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MCR106-8 PDF预览

MCR106-8

更新时间: 2024-11-20 22:46:19
品牌 Logo 应用领域
安森美 - ONSEMI 栅极局域网
页数 文件大小 规格书
4页 76K
描述
Sensitive Gate Silicon Controlled Rectifiers

MCR106-8 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-225AA
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:not_compliantHTS代码:8541.30.00.80
风险等级:5.03外壳连接:ANODE
配置:SINGLE关态电压最小值的临界上升速率:10 V/us
最大直流栅极触发电流:0.2 mA最大直流栅极触发电压:1 V
最大维持电流:5 mAJEDEC-95代码:TO-225AA
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
最大漏电流:0.2 mA通态非重复峰值电流:25 A
元件数量:1端子数量:3
最大通态电流:4000 A最高工作温度:110 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大均方根通态电流:4 A断态重复峰值电压:600 V
重复峰值反向电压:600 V子类别:Silicon Controlled Rectifiers
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED触发设备类型:SCR
Base Number Matches:1

MCR106-8 数据手册

 浏览型号MCR106-8的Datasheet PDF文件第2页浏览型号MCR106-8的Datasheet PDF文件第3页浏览型号MCR106-8的Datasheet PDF文件第4页 
Preferred Device  
Reverse Blocking Thyristors  
PNPN devices designed for high volume consumer applications  
such as temperature, light and speed control; process and remote control,  
and warning systems where reliability of operation is important.  
http://onsemi.com  
Glass-Passivated Surface for Reliability and Uniformity  
Power Rated at Economical Prices  
Practical Level Triggering and Holding Characteristics  
Flat, Rugged, Thermopad Construction for Low Thermal  
Resistance, High Heat Dissipation and Durability  
SCRs  
4 AMPERES RMS  
400 thru 600 VOLTS  
Device Marking: Device Type, e.g., MCR106–6, Date Code  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
A
K
Rating  
Symbol  
Value  
Unit  
(1)  
Peak Repetitive Off–State Voltage  
V
Volts  
DRM,  
(T = –40 to 110°C, Sine Wave 50 to  
V
RRM  
J
60 Hz, Gate Open)  
MCR106–6  
MCR106–8  
400  
600  
On-State RMS Current (T = 93°C)  
(180° Conduction Angles)  
I
4.0  
2.55  
25  
Amps  
Amps  
Amps  
C
T(RMS)  
Average On–State Current  
I
T(AV)  
(180° Conduction Angles; T = 93°C)  
C
Peak Non-repetitive Surge Current  
(1/2 Cycle, Sine Wave 60 Hz,  
I
TSM  
3
2
1
T = 110°C)  
J
TO–225AA  
(formerly TO–126)  
CASE 077  
2
2
Circuit Fusing Considerations  
(t = 8.3 ms)  
I t  
2.6  
0.5  
0.1  
0.2  
6.0  
A s  
STYLE 2  
Forward Peak Gate Power  
(T = 93°C, Pulse Width  
C
P
Watt  
Watt  
Amp  
Volts  
°C  
GM  
1.0 µs)  
PIN ASSIGNMENT  
Cathode  
Forward Average Gate Power  
(T = 93°C, t = 8.3 ms)  
C
P
G(AV)  
1
2
3
Anode  
Forward Peak Gate Current  
(T = 93°C, Pulse Width  
C
I
GM  
1.0 µs)  
1.0 µs)  
Gate  
Peak Reverse Gate Voltage  
(T = 93°C, Pulse Width  
C
V
RGM  
ORDERING INFORMATION  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
–40 to  
+110  
Device  
MCR106–6  
MCR106–8  
Package  
TO225AA  
TO225AA  
Shipping  
500/Box  
500/Box  
T
–40 to  
+150  
°C  
stg  
(2)  
Mounting Torque  
6.0  
in. lb.  
(1) V  
DRM  
and V  
for all types can be applied on a continuous basis. Ratings  
RRM  
Preferred devices are recommended choices for future use  
and best overall value.  
apply for zero or negative gate voltage; however, positive gate voltage shall  
not be applied concurrent with negative potential on the anode. Blocking  
voltages shall not be tested with a constant current source such that the  
voltage ratings of the devices are exceeded.  
(2) Torque rating applies with use of compression washer (B52200-F006 or  
equivalent). Mounting torque in excess of 6 in. lb. does not appreciably lower  
case-to-sink thermal resistance. Anode lead and heatsink contact pad are  
common. (See AN209B). For soldering purposes (either terminal connection  
or device mounting), soldering temperatures shall not exceed +200°C. For  
optimum results, an activated flux (oxide removing) is recommended.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
May, 2000 – Rev. 3  
MCR106/D  

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