MCP6061/2/4
60 µA, High Precision Op Amps
Features
Description
• Low Offset Voltage: ±150 µV (maximum)
• Low Quiescent Current: 60 µA (typical)
• Rail-to-Rail Input and Output
The Microchip Technology Inc. MCP6061/2/4 family of
operational amplifiers (op amps) has low input offset
voltage (±150 µV, maximum) and rail-to-rail input and
output operation. This family is unity gain stable and
has a gain bandwidth product of 730 kHz (typical).
These devices operate with a single supply voltage as
low as 1.8V, while drawing low quiescent current per
amplifier (60 µA, typical). These features make the
family of op amps well suited for single-supply, high
precision, battery-powered applications.
• Wide Supply Voltage Range: 1.8V to 6.0V
• Gain Bandwidth Product: 730 kHz (typical)
• Unity Gain Stable
• Extended Temperature Range: -40°C to +125°C
• No Phase Reversal
The MCP6061/2/4 family is offered in single
(MCP6061), dual (MCP6062), and quad (MCP6064)
configurations.
Applications
• Automotive
• Portable Instrumentation
• Sensor Conditioning
• Battery Powered Systems
• Medical Instrumentation
• Test Equipment
The MCP6061/2/4 is designed with Microchip’s
advanced CMOS process. All devices are available in
the extended temperature range, with a power supply
range of 1.8V to 6.0V.
Package Types
• Analog Filters
MCP6061
SOIC
MCP6062
SOIC
Design Aids
NC
V
V
1
2
3
4
8
1
8
7
6
5
NC
V
OUTA
DD
• SPICE Macro Models
V
V
V
• FilterLab® Software
7
6
5
2
3
4
V
–
+
V
–
INA
DD
OUTB
IN
V
–
V
V
+
INA
OUT
INB
IN
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
NC
+
V
V
INB
SS
SS
MCP6061
2x3 TDFN *
MCP6062
2x3 TDFN *
Typical Application
NC
V
OUTA
1
2
8
1
2
8
7
NC
V
V
V
DD
V
–
+
V
–
INA
V
7
IN
DD
OUTB
EP
9
EP
9
RL
V
V
V
+
–
IN
3
4
6
5
INA
3
4
6
5
OUT
INB
V
V
NC
V
+
SS
SS
INB
VOUT
ZIN
MCP6061
MCP6061
SOT-23-5
MCP6064
SOIC, TSSOP
V
1
2
3
4
5
6
7
14
13
12
11
10
9
V
OUTD
V
C
1
5
4
OUTA
V
OUT
DD
V
V
V
–
V
–
+
V
IND
2
3
INA
SS
ZIN = RL + jωL
L = RLRC
R
+
V
V
–
IND
INA
V
+
IN
IN
Gyrator
V
SS
DD
V
V
V
+
V
V
+
INC
INB
–
–
INB
INC
8
V
OUTC
OUTB
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2010 Microchip Technology Inc.
DS22189B-page 1