MCP6061/2/4
60 µA, High Precision Op Amps
Features
Description
• Low Offset Voltage: ±150 µV (maximum)
• Low Quiescent Current: 60 µA (typical)
• Rail-to-Rail Input and Output
The Microchip Technology Inc. MCP6061/2/4 family of
operational amplifiers (op amps) has low input offset
voltage (±150 µV, maximum) and rail-to-rail input and
output operation. This family is unity gain stable and
has a gain bandwidth product of 730 kHz (typical).
These devices operate with a single supply voltage as
low as 1.8V, while drawing low quiescent current per
amplifier (60 µA, typical). These features make the
family of op amps well suited for single-supply, high
precision, battery-powered applicaitons.
• Wide Supply Voltage Range: 1.8V to 6.0V
• Gain Bandwidth Product: 730 kHz (typical)
• Unity Gain Stable
• Extended Temperature Range: -40°C to +125°C
• No Phase Reversal
The MCP6061/2/4 family is offered in single
(MCP6061), dual (MCP6062), and quad (MCP6064)
configurations.
Applications
• Automotive
• Portable Instrumentation
• Sensor Conditioning
• Battery Powered Systems
• Medical Instrumentation
• Test Equipment
The MCP6061/2/4 is designed with Microchip’s
advanced CMOS process. All devices are available in
the extended temperature range, with a power supply
range of 1.8V to 6.0V.
Package Types
• Analog Filters
MCP6061
SOIC
MCP6062
SOIC
Design Aids
NC
VDD
1
2
3
4
8
1
VOUTA
8
7
6
5
NC
• SPICE Macro Models
• FilterLab® Software
VDD
VOUT
NC
VOUTB
7
6
5
2
3
4
VIN
–
+
VINA
–
+
VINB
VINB
–
+
VIN
VINA
• Mindi™ Circuit Designer & Simulator
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
VSS
VSS
MCP6061
2x3 TDFN *
MCP6062
2x3 TDFN *
NC
VOUTA
1
2
8
1
2
8
7
NC
VDD
Typical Application
VIN–
VINA
–
+
VDD
VOUT
VOUTB
7
EP
9
EP
9
VIN
+
VINA
VINB
VINB
–
+
3
4
6
5
3
4
6
5
RL
VSS
VSS
NC
VOUT
MCP6064
SOIC, TSSOP
ZIN
MCP6061
VOUTD
1
2
3
4
5
6
7
14
13
12
11
10
9
VOUTA
VIND
VIND
VSS
–
VINA
–
+
C
+
VINA
ZIN = RL + jωL
L = RLRC
R
VDD
VINB
VINB
Gyrator
VINC
+
–
+
–
VINC
VOUTC
8
VOUTB
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2009 Microchip Technology Inc.
DS22189A-page 1