MCP2025
LIN Transceiver with Voltage Regulator
Features:
Description:
• Compliant with LIN Bus Specifications Version
1.3, 2.1 and with SAE J2602-2
The MCP2025 provides a bidirectional, half-duplex
communication physical interface to meet the LIN bus
specification Revision 2.1 and SAE J2602-2. The
device incorporates a voltage regulator with 5V or 3.3V
at 70 mA regulated power supply output. The device
has been designed to meet the stringent quiescent
current requirements of the automotive industry, and
will survive +43V load dump transients and double
battery jumps.
• Supports Baud Rates up to 20 kBaud
• 43V Load Dump Protected
• Maximum Continuous Input Voltage: 30V
• Wide LIN-Compliant Supply Voltage: 6.0-18.0V
• Extended Temperature Range: -40°C to +125°C
• Interface to PIC® EUSART and Standard USARTs
• Wake-Up on LIN Bus Activity or Local Wake Input
• Local Interconnect Network (LIN) Bus Pin:
The MCP2025 family members include:
- MCP2025-500, 8-pin, LIN driver with 5.0V
regulator
- Internal Pull-Up Termination Resistor and
Diode for Slave Node
- MCP2025-330, 8-pin, LIN driver with 3.3V
regulator
- Protected Against VBAT Shorts
- Protected Against Loss of Ground
- High-Current Drive
Package Types
• TXD and LIN Bus Dominant Time-Out Function
• Two Low-Power Modes:
MCP2025
PDIP, SOIC
- Transmitter Off: 90 µA (typical)
- Power Down: 4.5 µA (typical)
• MCP2025 On-Chip Voltage Regulator:
VREG
1
2
3
4
8
7
6
5
VBB
RESET
TXD
CS/LWAKE
VSS
- Output Voltage of 5.0V or 3.3V
at 70 mA Capability with Tolerances of ±3%
Over the Temperature Range
RXD
LBUS
MCP2025
- Internal Short-Circuit Current Limit
4x4 DFN
- External Components Limited to Filter
Capacitor and Load Capacitor
VBB
VREG
1
8
7
6
5
CS/LWAKE
VSS
RESET
TXD
2
• Automatic Thermal Shutdown
EP
9
3
4
• High Electromagnetic Immunity (EMI), Low
Electromagnetic Emission (EME)
LBUS
RXD
• Robust ESD Performance: ±15 kV for LBUS and
VBB Pin (IEC61000-4-2)
• Transient Protection for LBUS and VBB pins in
Automotive Environment (ISO7637)
• Meets Stringent Automotive Design Requirements,
including “OEM Hardware Requirements for LIN,
CAN and FlexRay Interfaces in Automotive
Applications”, Version 1.3, May 2012
• Multiple Package Options, Including Small
4x4 mm DFN Package
2012-2014 Microchip Technology Inc.
DS20002306B-page 1