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MCM63P736TQ133R PDF预览

MCM63P736TQ133R

更新时间: 2024-11-29 22:54:51
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 存储内存集成电路静态存储器
页数 文件大小 规格书
20页 319K
描述
128K x 36 and 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM

MCM63P736TQ133R 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TQFP-100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:4 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:4718592 bit内存集成电路类型:CACHE SRAM
内存宽度:36功能数量:1
端口数量:1端子数量:100
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
输出特性:3-STATE可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

MCM63P736TQ133R 数据手册

 浏览型号MCM63P736TQ133R的Datasheet PDF文件第2页浏览型号MCM63P736TQ133R的Datasheet PDF文件第3页浏览型号MCM63P736TQ133R的Datasheet PDF文件第4页浏览型号MCM63P736TQ133R的Datasheet PDF文件第5页浏览型号MCM63P736TQ133R的Datasheet PDF文件第6页浏览型号MCM63P736TQ133R的Datasheet PDF文件第7页 
Order this document  
by MCM63P736/D  
SEMICONDUCTOR TECHNICAL DATA  
MCM63P736  
MCM63P818  
Product Preview  
128K x 36 and 256K x 18 Bit  
Pipelined BurstRAM  
Synchronous Fast Static RAM  
The MCM63P736 and MCM63P818 are 4M bit synchronous fast static RAMs  
designed to provide a burstable, high performance, secondary cache for the  
PowerPC and other high performance microprocessors. The MCM63P736 is  
organized as 128K words of 36 bits each and the MCM63P818 is organized as  
256K words of 18 bits each. These devices integrate input registers, an output  
register, a 2–bit address counter, and high speed SRAM onto a single monolithic  
circuit for reduced parts count in cache data RAM applications. Synchronous de-  
sign allows precise cycle control with the use of an external clock (K).  
Addresses (SA), data inputs (DQx), and all control signals except output  
enable(G), sleepmode(ZZ), andlinearburstorder(LBO)areclock(K)controlled  
through positive–edge–triggered noninverting registers.  
TQ PACKAGE  
TQFP  
CASE 983A–01  
ZP PACKAGE  
PBGA  
CASE 999–01  
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst  
addresses can be generated internally by the MCM63P736 and MCM63P818  
(burstsequenceoperatesinlinearorinterleavedmodedependentuponthestate  
of LBO) and controlled by the burst address advance (ADV) input pin.  
Write cycles are internally self–timed and are initiated by the rising edge of the  
clock (K) input. This feature eliminates complex off–chip write pulse generation  
and provides increased timing flexibility for incoming signals.  
Synchronous byte write (SBx), synchronous global write (SGW), and synchro-  
nous write enable (SW) are provided to allow writes to either individual bytes or  
toallbytes. Thebytesaredesignatedasa”, “b”, etc. SBacontrolsDQa, SBbcon-  
trols DQb, etc. Individual bytes are written if the selected byte writes SBx are as-  
serted with SW. All bytes are written if either SGW is asserted or if all SBx and  
SW are asserted.  
For read cycles, pipelined SRAMs output data is temporarily stored by an  
edge–triggeredoutput register and then released to the output buffers at the next  
rising edge of clock (K).  
The MCM63P736 and MCM63P818 operate from a 3.3 V core power supply  
and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and outputs  
are JEDEC standard JESD8–5 compatible.  
MCM63P736/MCM63P818–133 = 4 ns Access/7.5 ns Cycle (133 MHz)  
MCM63P736/MCM63P818–100 = 5 ns Access/10 ns Cycle (100 MHz)  
MCM63P736/MCM63P818–66 = 7 ns Access/15 ns Cycle (66 MHz)  
3.3 V + 10%, – 5% Core Power Supply, 2.5 V or 3.3 V I/O Supply  
ADSP, ADSC, and ADV Burst Control Pins  
Selectable Burst Sequencing Order (Linear/Interleaved)  
Two–Cycle Deselect Timing  
Internally Self–Timed Write Cycle  
Byte Write and Global Write Control  
Sleep Mode (ZZ)  
PB1 Version 2.0 Compatible  
JEDEC Standard 119–Pin PBGA and 100–Pin TQFP Packages  
The PowerPC name is a trademark of IBM Corp., used under license therefrom.  
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.  
10/8/97  
Motorola, Inc. 1997  

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