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MCM63F737K PDF预览

MCM63F737K

更新时间: 2024-10-02 11:05:59
品牌 Logo 应用领域
飞思卡尔 - FREESCALE /
页数 文件大小 规格书
20页 400K
描述
128K x 36 and 256K x 18 Bit Flow–Through BurstRAM Synchronous Fast Static RAM

MCM63F737K 数据手册

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Freescale Semiconductor, Inc.  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MCM63F737K/D  
MCM63F737K  
MCM63F819K  
Advance Information  
128K x 36 and 256K x 18 Bit  
Flow–Through BurstRAM  
Synchronous Fast Static RAM  
The MCM63F737K and MCM63F819K are 4M–bit synchronous fast static  
RAMs designedtoprovideaburstable, highperformance, secondarycache. The  
MCM63F737K (organized as 128K words by 36 bits) and the MCM63F819K  
(organized as 256K words by 18 bits) integrate input registers, a 2–bit address  
counter, and high speed SRAM onto a single monolithic circuit for reduced parts  
count in cache data RAM applications. Synchronous design allows precise cycle  
control with the use of an external clock (K).  
TQ PACKAGE  
TQFP  
CASE 983A–01  
Addresses (SA), data inputs (DQx), and all control signals except output  
enable(G), sleepmode(ZZ), andlinearburstorder(LBO)areclock(K)controlled  
through positive–edge–triggered noninverting registers.  
ZP PACKAGE  
PBGA  
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst  
addresses can be generated internally by the MCM63F737K and MCM63F819K  
(burstsequenceoperatesinlinearorinterleavedmodedependentuponthestate  
of LBO) and controlled by the burst address advance (ADV) input pin.  
Write cycles are internally self–timed and are initiated by the rising edge of the  
clock (K) input. This feature eliminates complex off–chip write pulse generation  
and provides increased timing flexibility for incoming signals.  
CASE 999–02  
Synchronous byte write (SBx), synchronous global write (SGW), and  
synchronous write enable (SW) are provided to allow writes to either individual  
bytes or to all bytes. The bytes are designated as “a”, “b”, etc. SBa controls DQa,  
SBb controls DQb, etc. Individual bytes are written if the selected byte writes SBx  
are asserted with SW. All bytes are written if either SGW is asserted or if all SBx  
and SW are asserted.  
For read cycles, a flow–through SRAM allows output data to simply flow freely  
from the memory array.  
TheMCM63F737KandMCM63F819Koperatefroma3.3Vcorepowersupply  
and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and outputs  
are JEDEC standard JESD8–5 compatible.  
MCM63F737K/MCM63F819K–8.5 = 8.5 ns Access  
MCM63F737K/MCM63F819K–9 ns = 9 ns Access  
MCM63F737K/MCM63F819K–11 ns = 11 ns Access  
3.3 V +10%, –5% Core Power Supply, 2.5 V or 3.3 V I/O Supply  
ADSP, ADSC, and ADV Burst Control Pins  
Selectable Burst Sequencing Order (Linear/Interleaved)  
Single–Cycle Deselect Timing  
Internally Self–Timed Write Cycle  
Byte Write and Global Write Control  
Sleep Mode (ZZ)  
JEDEC Standard 100–Pin TQFP and 119–Pin PBGA Packages  
This document contains information on a new product. Specifications and information herein are subject to change without notice.  
10/1/99  
Motorola, Inc. 1999  
For More Information On This Product,  
Go to: www.freescale.com  

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