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MCM56824AZP25R2 PDF预览

MCM56824AZP25R2

更新时间: 2024-11-10 22:06:03
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 内存集成电路静态存储器双倍数据速率
页数 文件大小 规格书
10页 151K
描述
8K x 24 Bit Fast Static RAM

MCM56824AZP25R2 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA86,9X10
针数:86Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.9Is Samacsys:N
最长访问时间:25 ns其他特性:ON-CHIP ADDRESS MULTIPLEXER; DSPRAM
I/O 类型:COMMONJESD-30 代码:R-PBGA-B86
JESD-609代码:e0长度:17.78 mm
内存密度:196608 bit内存集成电路类型:APPLICATION SPECIFIC SRAM
内存宽度:24功能数量:1
端口数量:1端子数量:86
字数:8192 words字数代码:8000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:8KX24
输出特性:3-STATE可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA86,9X10封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified座面最大高度:2.44 mm
最大待机电流:0.01 A最小待机电流:4.5 V
子类别:SRAMs最大压摆率:0.22 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.524 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:16.26 mm
Base Number Matches:1

MCM56824AZP25R2 数据手册

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Order this document  
by MCM56824A/D  
SEMICONDUCTOR TECHNICAL DATA  
MCM56824A  
DSPRAM  
8K x 24 Bit Fast Static RAM  
The MCM56824A is a 196,608 bit static random access memory organized as  
8,192 words of 24 bits. The device integrates an 8K x 24 SRAM core with multiple  
chipenableinputs, outputenable, andanexternallycontrolledsingleaddresspin  
multiplexer. These functions allow for direct connection to the Motorola  
DSP56001 Digital Signal Processor and provide a very efficient means for imple-  
mentation of a reduced parts count system requiring noadditionalinterfacelogic.  
The availability of multiple chip enable (E1 and E2) and output enable (G) in-  
puts provides for greater system flexibility when multiple devices are used. With  
either chip enable input unasserted, the device will enter standby mode, useful  
inlow–powerapplications. Asingleon–chipmultiplexerselectsA12orX/Yasthe  
highest order address input depending upon the state of the V/S control input.  
This feature allows one physical static RAM component to efficiently store pro-  
gram and vector or scalar operands by dynamically re–partitioning the RAM  
array. Typical applications will logically map vector operands into upper memory  
with scalar operands being stored in lower memory. By connecting  
DSP56001address A15 to the VECTOR/SCALAR (V/S) MUX control  
pin, such partitioning can occur with no additional components. This al-  
lows efficient utilization of the RAM resource irrespective of operand  
FN PACKAGE  
52–LEAD PLCC  
CASE 778–02  
9 x 10 GRID  
86 BUMP PBGA  
CASE 896A–01  
PIN ASSIGNMENTS  
PLCC  
7
6
5
4
3
2
1
52 51 50 49 48 47  
46  
DQ0  
8
9
DQ23  
DQ22  
DQ21  
type. See application diagrams at the end of this document for addition-  
al information.  
Multiplepowerandgroundpinshavebeenutilizedtominimizeeffects  
induced by output noise.  
The MCM56824A is available in a 52 pin plastic leaded chip–carrier  
(PLCC) and a 9 x 10 grid, 86 bump surface mount PBGA.  
45  
44  
43  
42  
DQ1  
DQ2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
V
V
DQ20  
SS  
SS  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ8  
41  
40  
39  
38  
37  
36  
35  
34  
DQ19  
DQ18  
DQ17  
DQ16  
DQ15  
Single 5 V ± 10% Power Supply  
Fast Access and Cycle Times: 20/25/35 ns Max  
Fully Static Read and Write Operations  
Equal Address and Chip Enable Access Times  
Single Bit On–Chip Address Multiplexer  
Active High and Active Low Chip Enable Inputs  
Output Enable Controlled Three State Outputs  
High Board Density PLCC Package  
Low Power Standby Mode  
V
DQ9  
V
SS  
SS  
DQ14  
DQ13  
DQ10  
21 22 23 24 25 26 27 28 29 30 31 32 33  
VIEW OF PBGA PACKAGE BOTTOM  
Fully TTL Compatible  
10  
9
8
7
6
5
4
3
2
1
PIN NAMES  
A
B
C
D
E
D13  
V
D16 D17 D18 D20 D21 D23  
SS  
A0 – A11 . . . . . . . . . . . . . . . Address Inputs  
A12, X/Y . . . . . . . . . . Multiplexed Address  
V/S . . . . . . . . . Address Multiplexer Control  
W . . . . . . . . . . . . . . . . . . . . . . . Write Enable  
E1, E2 . . . . . . . . . . . . . . . . . . . Chip Enable  
G . . . . . . . . . . . . . . . . . . . . . . Output Enable  
DQ0 – DQ23 . . . . . . . . . . Data Input/Output  
. . . . . . . . . . . . . . . +5 V Power Supply  
. . . . . . . . . . . . . . . . . . . . . . . . . . Ground  
NC . . . . . . . . . . . . . . . . . . . . No Connection  
W
D12 D14 D15  
E2  
D19  
V
D22 A5  
A3  
A4  
SS  
A2  
A0  
E1  
SS  
V
V
SS  
A1  
V
V
CC  
CC  
V
CC  
V
SS  
F
G
A6  
A8  
V/S NC  
G
A7  
A9  
X/Y  
A12  
For proper operation of the device, all V  
SS  
pins must be connected to ground.  
H
J
D11  
D9  
D8  
D7  
D4  
D5  
V
D1 A10 A11  
SS  
D10  
V
D6  
D3  
D2  
D0  
SS  
DSPRAM is a trademark of Motorola, Inc.  
Not to Scale  
REV 2  
4/95  
Motorola, Inc. 1995  

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