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MCM32130SHG60 PDF预览

MCM32130SHG60

更新时间: 2024-11-11 20:46:19
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 动态存储器内存集成电路
页数 文件大小 规格书
14页 307K
描述
Fast Page DRAM Module, 1MX32, 60ns, CMOS, SIMM-72

MCM32130SHG60 技术参数

生命周期:Obsolete零件包装代码:SIMM
包装说明:,针数:72
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
访问模式:FAST PAGE最长访问时间:60 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH备用内存宽度:16
JESD-30 代码:R-XSMA-N72内存密度:33554432 bit
内存集成电路类型:FAST PAGE DRAM MODULE内存宽度:32
功能数量:1端口数量:1
端子数量:72字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX32输出特性:3-STATE
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY认证状态:Not Qualified
刷新周期:1024最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子位置:SINGLEBase Number Matches:1

MCM32130SHG60 数据手册

 浏览型号MCM32130SHG60的Datasheet PDF文件第2页浏览型号MCM32130SHG60的Datasheet PDF文件第3页浏览型号MCM32130SHG60的Datasheet PDF文件第4页浏览型号MCM32130SHG60的Datasheet PDF文件第5页浏览型号MCM32130SHG60的Datasheet PDF文件第6页浏览型号MCM32130SHG60的Datasheet PDF文件第7页 
Order this document  
by MCM32130/D  
SEMICONDUCTOR  
TECHNICAL DATA  
MCM32130  
MCM32T100  
1M x 32 Bit Dynamic Random  
Access Memory Module  
The MCM32130 is a 32M dynamic random access memory (DRAM) module  
organized as 1,048,576 x 32 bits. The module is a 72–lead single–in–line memory  
module (SIMM) consisting of eight MCM54400AN DRAMs housed in standard 300  
mil SOJ packages mounted on a substrate along with a 0.22 µF (min) decoupling  
capacitor mounted under each DRAM. The MCM54400AN is a CMOS high speed  
dynamic random access memory organized as 1,048,576 four–bit words and fabri-  
cated with CMOS silicon–gate process technology.  
SH PACKAGE  
SIMM MODULE  
CASE 866–02  
MCM32130  
Three–State Data Output  
Early–Write Common I/O Capability  
Fast Page Mode Capability  
TTL–Compatible Inputs and Outputs  
RAS–Only Refresh  
CAS Before RAS Refresh  
SH PACKAGE  
SIMM MODULE  
CASE 866H–01  
MCM32T100  
Hidden Refresh  
1024 Cycle Refresh: = 16 ms (Max)  
Consists of Eight 1M x 4 DRAMs and Eight 0.22 µF (Min) Decoupling Capacitors  
Unlatched Data Out at Cycle End Allows Two Dimensional Chip Selection  
TOP VIEW  
Fast Access Time (t  
RAC  
): MCM32130–60 = 60 ns (Max)  
MCM32130–70 = 70 ns (Max)  
1
Low Active Power Dissipation: MCM32130–60 = 5.28 W (Max)  
MCM32130–70 = 4.40 W (Max)  
Low Standby Power Dissipation: TTL Levels = 88 mW (Max)  
CMOS Levels = 44 mW (Max)  
Also Available in TSOP Version MCM32T100  
PIN NAMES  
A0 – A9 . . . . . . . . . . . . . . . . Address Inputs  
CAS0 – CAS3 . . Column Address Strobe  
RAS0, RAS2 . . . . . . . Row Address Strobe  
DQ0 – DQ31 . . . . . . Data Input/Output  
PD1 – PD4 . . . . . . . . Presence Detect  
W . . . . . . . . . . . . . . . . Read/Write Input  
36  
37  
V
. . . . . . . . . . . . . . . . . . . . Power (+ 5 V)  
V
SS  
. . . . . . . . . . . . . . . . . . . . . . Ground  
CC  
NC . . . . . . . . . . . . . . . . . . . . No Connection  
All power supply and ground pins must be connected for proper operation of the device.  
PIN ASSIGNMENT  
Pin  
Name  
Pin  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Name  
A1  
Pin  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
Name  
DQ22  
DQ7  
DQ23  
A7  
Pin  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
Name  
NC  
Pin  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
Name  
DQ8  
Pin  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
Name  
DQ13  
DQ30  
DQ14  
DQ31  
DQ15  
NC  
1
V
SS  
2
DQ0  
DQ16  
DQ1  
A2  
NC  
DQ24  
DQ9  
3
A3  
V
SS  
4
A4  
CAS0  
CAS2  
CAS3  
CAS1  
RAS0  
NC  
DQ25  
DQ10  
DQ26  
DQ11  
DQ27  
DQ12  
DQ28  
5
DQ17  
DQ2  
A5  
NC  
6
A6  
V
CC  
7
DQ18  
DQ3  
NC  
A8  
PD1  
72  
8
DQ4  
DQ20  
DQ5  
DQ21  
DQ6  
A9  
PD2  
9
DQ19  
NC  
PD3  
10  
11  
12  
V
RAS2  
NC  
NC  
PD4  
CC  
NC  
A0  
W
V
NC  
CC  
DQ29  
NC  
NC  
V
SS  
REV 3  
8/95  
Motorola, Inc. 1995  

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