是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, BGA256,16X16,40 | 针数: | 256 |
Reach Compliance Code: | compliant | ECCN代码: | 5A992 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.73 |
地址总线宽度: | 24 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 80 MHz |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B256 |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 256 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA256,16X16,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 电源: | 1.2,1.8/3.3,3.3 V |
认证状态: | Not Qualified | 速度: | 240 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.32 V |
最小供电电压: | 1.08 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper - with Nickel barrier | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCF53015CMJ240 | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53015CMJ240J | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53015CMJ240J | NXP |
获取价格 |
MICROPROCESSOR, PBGA256, 17 X 17 MM, ROHS COMPLIANT, PLASTIC, MAPBGA-256 | |
MCF53016CMJ240 | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53016CMJ240J | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53016CMJ240J | NXP |
获取价格 |
CFV3 VOIP | |
MCF53017 | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53017_10 | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53017CMJ240 | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC | |
MCF53017CMJ240J | FREESCALE |
获取价格 |
Version 3 ColdFire? core with EMAC |