是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | TSOP | 包装说明: | TSSOP, TSOP5/6,.11,37 |
针数: | 5 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.3 | 系列: | AHC/VHC |
JESD-30 代码: | R-PDSO-G5 | JESD-609代码: | e3 |
长度: | 3 mm | 负载电容(CL): | 50 pF |
逻辑集成电路类型: | BUFFER | 最大I(ol): | 0.008 A |
湿度敏感等级: | 1 | 功能数量: | 1 |
输入次数: | 1 | 端子数量: | 5 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出特性: | OPEN-DRAIN | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSOP5/6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2/5.5 V |
Prop。Delay @ Nom-Sup: | 10 ns | 传播延迟(tpd): | 14.5 ns |
认证状态: | Not Qualified | 施密特触发器: | NO |
座面最大高度: | 1.1 mm | 子类别: | Gates |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 1.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
74V1G07STR | STMICROELECTRONICS |
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