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MC74AC257DG PDF预览

MC74AC257DG

更新时间: 2024-11-06 01:12:19
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管逻辑集成电路
页数 文件大小 规格书
9页 101K
描述
Quad 2-Input Multiplexer with 3-State Outputs

MC74AC257DG 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:SOIC包装说明:SOP,
针数:16Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.11
系列:ACJESD-30 代码:R-PDSO-G16
长度:9.9 mm逻辑集成电路类型:MULTIPLEXER
功能数量:4输入次数:2
输出次数:1端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED传播延迟(tpd):9 ns
认证状态:Not Qualified座面最大高度:1.75 mm
最大供电电压 (Vsup):6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmBase Number Matches:1

MC74AC257DG 数据手册

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MC74AC257, MC74ACT257  
Quad 2-Input Multiplexer  
with 3-State Outputs  
The MC74AC257/74ACT257 is a quad 2−input multiplexer with  
3−state outputs. Four bits of data from two sources can be selected  
using a Common Data Select input. The four outputs present the  
selected data in true (noninverted) form. The outputs may be switched  
to a high impedance state by placing a logic HIGH on the common  
Output Enable (OE) input, allowing the outputs to interface directly  
with bus−oriented systems.  
www.onsemi.com  
MARKING  
DIAGRAMS  
16  
1
Multiplexer Expansion by Tying Outputs Together  
Noninverting 3−State Outputs  
SOIC−16  
D SUFFIX  
CASE 751B  
xxx257G  
AWLYWW  
16  
Outputs Source/Sink 24 mA  
1
ACT257 Has TTL Compatible Inputs  
These are Pb−Free Devices  
16  
xxx  
257  
TSSOP−16  
DT SUFFIX  
CASE 948F  
16  
V
OE  
15  
I
I
Z
I
I
Z
d
CC  
0c  
1c  
c
0d  
1d  
ALYWG  
G
16  
14  
13  
12  
11  
10  
9
1
1
xxx  
= AC or ACT  
A
= Assembly Location  
WL or L = Wafer Lot  
= Year  
WW or W = Work Week  
Y
1
2
3
4
5
6
7
8
G or G  
= Pb−Free Package  
S
I
I
Z
I
I
Z
b
GND  
0a  
1a  
a
0b  
1b  
(Note: Microdot may be in either location)  
Figure 1. Pinout: 16−Lead Packages Conductors  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
March, 2015 − Rev. 8  
MC74AC257/D  

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