Datasheet > MC5618

MC5618

更新时间： 2024-11-15 04:16:31

品牌	Logo	应用领域
美高森美 - MICROSEMI		高压高功率电源快速恢复大电源快速恢复二极管
页数	文件大小	规格书
2页	277K
描述
FAST RECOVERY HIGH POWER MICRO HIGH VOLTAGE RECTIFIERS

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

MC5618 数据手册

MC5610 thru MC5619

FAST RECOVERY, HIGH POWER,

MICRO, HIGH VOLTAGE RECTIFIERS

S C O T T S D A L E D I V I S I O N

DESCRIPTION

APPEARANCE

The MC5610 through MC5619 series of fast recovery high voltage silicon

rectifiers feature the smallest packages available. They are ideal for high-

reliability where a failure cannot be tolerated. These 0.275 to 0.790 Amp

rated rectifiers for working peak reverse voltages from 1500 to 5000 volts are

hermetically sealed with voidless-glass construction using an internal

“Category I” metallurgical bond. Typical applications include transmitters,

power supplies, radar equipment and X-ray machines. Surface mount MELF

package configurations are also available by adding “SM” suffix. Microsemi

also offers numerous other rectifier products to meet higher and lower

current ratings with various recovery time speed requirements including fast

and ultrafast device types in both through-hole and surface mount packages.

S Package

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

Voidless Hermetically Sealed Glass Package

Triple-Layer Passivation

Internal “Category I” Metallurgical bonds

Lowest Reverse Leakage Available

Lowest Thermal Resistance Available

Absolute High Voltage / High Temperature Stability

•

High voltage fast recovery rectifiers 1500 to 5000 V

•

Military and other high-reliability applications

Applications include bridges, half-bridges, catch

diodes, voltage multipliers, X-ray machines, power

supplies, transmitters, and radar equipment

High forward surge current capability

•

Extremely robust construction

Surface mount equivalents also available in a square

•

Inherently radiation hard as described in Microsemi

end-cap MELF configuration with “SM” suffix

MicroNote 050

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

Operating Temperature Range:

•

CASE: Hermetically sealed voidless hard glass with

MC5610 – MC5612……-55^oC to 150^oC

MC5613 – MC5616……-65^oC to 150^oC

MC5617 – MC5619……-65^oC to 125^oC

Storage Temperature Range: -65^oC to 175^oC

Tungsten slugs

TERMINATIONS: Axial leads are copper with

Tin/Lead (Sn/Pb) finish

MARKING: Body paint and part number, etc.

POLARITY: Cathode band

TAPE & REEL option: Standard per EIA-296

WEIGHT: 400 mg (approx)

See package dimensions on last page

•

Thermal Resistance: 38^oC/W junction to lead at 3/8

inch (10 mm) lead length from body

•

Average Rectified Forward Current (I_O): See

Electrical Characteristics for maximum rating at 55^oC

and 100^oC. Also see typical linear derating in Fig 1.

•

Forward Surge Current: See Electrical

Characteristics for surge at 8.3 ms half-sine wave

Solder Temperatures: 260ºC for 10 s (maximum)

Microsemi

Page 1

12-29 2004 REV A

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

中文翻译

下载PDF

与MC5618相关器件

型号	品牌	获取价格	描述	数据表
MC5619	MICROSEMI	获取价格	FAST RECOVERY HIGH POWER MICRO HIGH VOLTAGE RECTIFIERS
MC5619E3	MICROSEMI	获取价格	Rectifier Diode, 1 Element, 0.275A, 5000V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED
MC5619SM	MICROSEMI	获取价格	Rectifier Diode, 1 Element, 0.275A, Silicon, HERMETIC SEALED, GLASS, MELF-2
MC564L	MOTOROLA	获取价格	R-S Flip-Flop, 1-Func, TTL, CDIP14
MC56603AGC60	NXP	获取价格	24-BIT, 60MHz, OTHER DSP, PBGA144, PLASTIC, BGA-144
MC56603APV60	NXP	获取价格	24-BIT, 60MHz, OTHER DSP, PQFP144, PLASTIC, TQFP-144
MC56F8000RM	FREESCALE	获取价格	16-bit Digital Signal Controllers
MC56F8002	FREESCALE	获取价格	Digital Signal Controller
MC56F8002MWL	NXP	获取价格	16-BIT, FLASH, 32MHz, MICROCONTROLLER, PDSO28, 7.50 X 18 MM, ROHS COMPLIANT, MS-013AE, SOI
MC56F8002VWL	FREESCALE	获取价格	Digital Signal Controller

与MC5618相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

11
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

4
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

30
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

13

产品中心

服务支持

精选活动

关于我们

帮助中心

MC5618

MC5618 数据手册

与MC5618相关器件

与MC5618相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MC5618

MC5618 数据手册

与MC5618相关器件

与MC5618相关文章

您还可以找

您在本页遇到什么问题？