Datasheet > MC5619SM

MC5619SM

更新时间： 2024-11-15 15:40:59

品牌	Logo	应用领域
美高森美 - MICROSEMI		二极管
页数	文件大小	规格书
2页	288K
描述
Rectifier Diode, 1 Element, 0.275A, Silicon, HERMETIC SEALED, GLASS, MELF-2

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技术参数
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MC5619SM 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	零件包装代码：	MELF
包装说明：	HERMETIC SEALED, GLASS, MELF-2	针数：	2
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.10.00.70	风险等级：	5.53
其他特性：	METALLURGICALLY BONDED	外壳连接：	ISOLATED
配置：	SINGLE	二极管元件材料：	SILICON
二极管类型：	RECTIFIER DIODE	JESD-30 代码：	O-LELF-R2
JESD-609代码：	e0	元件数量：	1
端子数量：	2	最大输出电流：	0.275 A
封装主体材料：	GLASS	封装形状：	ROUND
封装形式：	LONG FORM	峰值回流温度（摄氏度）：	NOT SPECIFIED
认证状态：	Not Qualified	最大反向恢复时间：	0.3 µs
表面贴装：	YES	端子面层：	TIN LEAD
端子形式：	WRAP AROUND	端子位置：	END
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

MC5619SM 数据手册

MC5610 thru MC5619

FAST RECOVERY, HIGH POWER,

MICRO, HIGH VOLTAGE RECTIFIERS

S C O T T S D A L E D I V I S I O N

DESCRIPTION

APPEARANCE

The MC5610 through MC5619 series of fast recovery high voltage silicon

rectifiers feature the smallest packages available. They are ideal for high-

reliability where a failure cannot be tolerated. These 0.275 to 0.790 Amp

rated rectifiers for working peak reverse voltages from 1500 to 5000 volts are

hermetically sealed with voidless-glass construction using an internal

“Category I” metallurgical bond. Typical applications include transmitters,

power supplies, radar equipment and X-ray machines. Surface mount MELF

package configurations are also available by adding “SM” suffix. Microsemi

also offers numerous other rectifier products to meet higher and lower

current ratings with various recovery time speed requirements including fast

and ultrafast device types in both through-hole and surface mount packages.

S Package

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

Voidless Hermetically Sealed Glass Package

Triple-Layer Passivation

Internal “Category I” Metallurgical bonds

Lowest Reverse Leakage Available

Lowest Thermal Resistance Available

Absolute High Voltage / High Temperature Stability

•

High voltage fast recovery rectifiers 1500 to 5000 V

•

Military and other high-reliability applications

Applications include bridges, half-bridges, catch

diodes, voltage multipliers, X-ray machines, power

supplies, transmitters, and radar equipment

High forward surge current capability

•

Extremely robust construction

Surface mount equivalents also available in a square

•

Inherently radiation hard as described in Microsemi

end-cap MELF configuration with “SM” suffix

MicroNote 050

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

Operating Temperature Range:

•

CASE: Hermetically sealed voidless hard glass with

MC5610 – MC5612……-55^oC to 150^oC

MC5613 – MC5616……-65^oC to 150^oC

MC5617 – MC5619……-65^oC to 125^oC

Storage Temperature Range: -65^oC to 175^oC

Tungsten slugs

TERMINATIONS: Axial leads are copper with

Tin/Lead (Sn/Pb) finish

MARKING: Body paint and part number, etc.

POLARITY: Cathode band

TAPE & REEL option: Standard per EIA-296

WEIGHT: 400 mg (approx)

See package dimensions on last page

•

Thermal Resistance: 38^oC/W junction to lead at 3/8

inch (10 mm) lead length from body

•

Average Rectified Forward Current (I_O): See

Electrical Characteristics for maximum rating at 55^oC

and 100^oC. Also see typical linear derating in Fig 1.

•

Forward Surge Current: See Electrical

Characteristics for surge at 8.3 ms half-sine wave

Solder Temperatures: 260ºC for 10 s (maximum)

Microsemi

Page 1

12-29 2004 REV A

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

中文翻译

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