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MC14512BALDS PDF预览

MC14512BALDS

更新时间: 2024-11-30 13:11:15
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
6页 209K
描述
Multiplexer, 4000/14000/40000 Series, 1-Func, 8 Line Input, 1 Line Output, True Output, CMOS, CDIP16, 620-09

MC14512BALDS 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:620-09Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.19
Is Samacsys:N系列:4000/14000/40000
JESD-30 代码:R-GDIP-T16JESD-609代码:e0
长度:19.3 mm负载电容(CL):50 pF
逻辑集成电路类型:MULTIPLEXER功能数量:1
输入次数:8输出次数:1
端子数量:16最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP16,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:5/15 V
传播延迟(tpd):650 ns认证状态:Not Qualified
座面最大高度:4.19 mm子类别:Multiplexer/Demultiplexers
最大供电电压 (Vsup):18 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

MC14512BALDS 数据手册

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SEMICONDUCTOR TECHNICAL DATA  
L SUFFIX  
CERAMIC  
CASE 620  
The MC14512B is an 8–channel data selector constructed with MOS  
P–channel and N–channel enhancement mode devices in a single  
monolithic structure. This data selector finds primary application in signal  
multiplexing functions. It may also be used for data routing, digital signal  
switching, signal gating, and number sequence generation.  
P SUFFIX  
PLASTIC  
CASE 648  
Diode Protection on All Inputs  
Single Supply Operation  
3–State Output (Logic “1”, Logic “0”, High Impedance)  
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
Capable of Driving Two Low–power TTL Loads or One Low–power  
Schottky TTL Load Over the Rated Temperature Range  
D SUFFIX  
SOIC  
CASE 751B  
MAXIMUM RATINGS* (Voltages Referenced to V  
)
SS  
ORDERING INFORMATION  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Unit  
V
MC14XXXBCP  
MC14XXXBCL  
MC14XXXBD  
Plastic  
Ceramic  
SOIC  
V
DD  
– 0.5 to + 18.0  
V , V  
in out  
Input or Output Voltage (DC or Transient)  
– 0.5 to V  
DD  
+ 0.5  
V
T
= – 55° to 125°C for all packages.  
A
I , I  
in out  
Input or Output Current (DC or Transient),  
per Pin  
± 10  
mA  
P
Power Dissipation, per Package†  
Storage Temperature  
500  
mW  
C
D
PIN ASSIGNMENT  
T
stg  
– 65 to + 150  
260  
X0  
X1  
X2  
X3  
X4  
X5  
X6  
1
2
16  
15  
V
DD  
T
Lead Temperature (8–Second Soldering)  
C
L
DIS  
Z
* Maximum Ratings are those values beyond which damage to the device may occur.  
Temperature Derating:  
3
4
5
6
7
8
14  
13  
12  
11  
10  
9
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C  
Ceramic “L” Packages: – 12 mW/ C From 100 C To 125 C  
C
B
TRUTH TABLE  
A
C
B
A
Inhibit  
Disable  
Z
INH  
X7  
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
X0  
X1  
X2  
X3  
V
SS  
1
1
1
1
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
X4  
X5  
X6  
X7  
This device contains protection circuitry to  
guard against damage due to high static  
voltages or electric fields. However, pre-  
cautions must be taken to avoid applications of  
any voltage higher than maximum rated volt-  
ages to this high–impedance circuit. For proper  
X
X
X
X
X
X
1
X
0
1
0
High  
Impedance  
operation, V and V  
should be constrained  
in  
out  
to the range V  
(V or V  
in out  
)
V
DD  
.
SS  
X = Don’t Care  
Unused inputs must always be tied to an  
appropriatelogic voltage level (e.g., either V  
SS  
or V ). Unused outputs must be left open.  
DD  
REV 3  
1/94  
Motorola, Inc. 1995  

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