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MC14070BDG PDF预览

MC14070BDG

更新时间: 2024-01-17 22:08:49
品牌 Logo 应用领域
安森美 - ONSEMI 栅极触发器逻辑集成电路石英晶振光电二极管PC
页数 文件大小 规格书
6页 86K
描述
CMOS SSI

MC14070BDG 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP,针数:14
Reach Compliance Code:unknown风险等级:5.77
系列:4000/14000/40000JESD-30 代码:R-PDSO-G14
JESD-609代码:e0长度:10.2 mm
逻辑集成电路类型:XOR GATE功能数量:4
输入次数:2端子数量:14
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED传播延迟(tpd):350 ns
认证状态:COMMERCIAL座面最大高度:2.05 mm
最大供电电压 (Vsup):18 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5.275 mm
Base Number Matches:1

MC14070BDG 数据手册

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MC14070B, MC14077B  
CMOS SSI  
Quad Exclusive “OR” and “NOR” Gates  
The MC14070B quad exclusive OR gate and the MC14077B quad  
exclusive NOR gate are constructed with MOS P−channel and  
N−channel enhancement mode devices in a single monolithic  
structure. These complementary MOS logic gates find primary use  
where low power dissipation and/or high noise immunity is desired.  
http://onsemi.com  
MARKING  
DIAGRAMS  
Features  
14  
1
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
All Outputs Buffered  
Capable of Driving Two Low−Power TTL Loads or One Low−Power  
Schottky TTL Load Over the Rated Temperature Range  
Double Diode Protection on All Inputs  
PDIP−14  
P SUFFIX  
CASE 646  
MC140xxBCP  
AWLYYWW  
MC14070B − Replacement for CD4030B and CD4070B Types  
MC14077B − Replacement for CD4077B Type  
Pb−Free Packages are Available*  
14  
SOIC−14  
D SUFFIX  
CASE 751A  
140xxB  
AWLYWW  
1
MAXIMUM RATINGS (Voltages Referenced to V  
)
SS  
Symbol  
Parameter  
Value  
0.5 to +18.0  
Unit  
V
14  
V
DD  
DC Supply Voltage Range  
SOEIAJ−14  
F SUFFIX  
CASE 965  
MC140xxB  
AWLYWW  
V , V  
in out  
Input or Output Voltage Range  
(DC or Transient)  
0.5 to V + 0.5  
V
DD  
1
I , I  
in out  
Input or Output Current  
(DC or Transient) per Pin  
±10  
mA  
xx  
A
WL, L  
YY, Y  
= Specific Device Code  
= Assembly Location  
= Wafer Lot  
P
Power Dissipation, per Package  
(Note 1)  
500  
mW  
D
T
A
Ambient Temperature Range  
Storage Temperature Range  
55 to +125  
65 to +150  
260  
°C  
°C  
°C  
= Year  
WW, W = Work Week  
T
stg  
T
Lead Temperature  
L
(8−Second Soldering)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. Temperature Derating:  
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
high−impedance circuit. For proper operation, V and V should be constrained  
in  
out  
to the range V v (V or V ) v V  
.
SS  
in  
out  
DD  
Unused inputs must always be tied to an appropriate logic voltage level  
(e.g., either V or V ). Unused outputs must be left open.  
SS  
DD  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
February, 2005 − Rev. 5  
MC14070B/D  
 

MC14070BDG 替代型号

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