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MC14049BFL1 PDF预览

MC14049BFL1

更新时间: 2024-11-04 21:07:43
品牌 Logo 应用领域
安森美 - ONSEMI 输入元件光电二极管逻辑集成电路
页数 文件大小 规格书
8页 101K
描述
4000/14000/40000 SERIES, HEX 1-INPUT INVERT GATE, PDSO16, EIAJ, PLASTIC, SOIC-16

MC14049BFL1 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.21系列:4000/14000/40000
JESD-30 代码:R-PDSO-G16长度:10.2 mm
逻辑集成电路类型:INVERTER功能数量:6
输入次数:1端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
传播延迟(tpd):140 ns认证状态:Not Qualified
座面最大高度:2.05 mm最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:5.275 mmBase Number Matches:1

MC14049BFL1 数据手册

 浏览型号MC14049BFL1的Datasheet PDF文件第2页浏览型号MC14049BFL1的Datasheet PDF文件第3页浏览型号MC14049BFL1的Datasheet PDF文件第4页浏览型号MC14049BFL1的Datasheet PDF文件第5页浏览型号MC14049BFL1的Datasheet PDF文件第6页浏览型号MC14049BFL1的Datasheet PDF文件第7页 
GENERAL DATA IS APPLICABLE TO ALL  
SERIES IN THIS GROUP  
The SMC series is designed to protect voltage sensitive  
components from high voltage, high energy transients. They have  
excellent clamping capability, high surge capability, low zener  
impedance and fast response time. The SMC series is supplied in  
ON Semiconductor’s exclusive, cost-effective, highly reliable  
Surmetic package and is ideally suited for use in communication  
systems, numerical controls, process controls, medical equipment,  
business machines, power supplies and many other  
industrial/consumer applications.  
http://onsemi.com  
PLASTIC SURFACE MOUNT  
ZENER OVERVOLTAGE  
TRANSIENT SUPPRESSORS  
5.8–78 VOLTS  
1500 WATT PEAK POWER  
Specification Features:  
Standard Zener Breakdown Voltage Range — 6.8 to 91 V  
Stand–off Voltage Range — 5.8 to 78 V  
Peak Power — 1500 Watts @ 1 ms  
Maximum Clamp Voltage @ Peak Pulse Current  
Low Leakage < 5 µA Above 10 V  
UL Recognition  
Maximum Temperature Coefficient Specified  
Available in Tape and Reel  
Response Time is Typically < 1 ns  
SMC  
PLASTIC  
CASE 403  
ORDERING INFORMATION  
Device  
Package  
Shipping  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
FINISH: All external surfaces are corrosion resistant and leads are  
readily solderable  
1.5SMCXXXAT3  
SMC  
Tape and Reel  
2500 Units/Reel  
POLARITY: Cathode indicated by molded polarity notch. When  
operated in zener mode, will be positive with respect to anode  
MOUNTING POSITION: Any  
Devices listed in bold, italic are ON Semiconductor  
Preferred devices. Preferred devices are recommended  
choices for future use and best overall value.  
LEADS: Modified L–Bend providing more contact area to bond pads  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
WAFER FAB LOCATION: Phoenix, Arizona  
ASSEMBLY/TEST LOCATION: Seremban, Malaysia  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Power Dissipation (1)  
P
PK  
1500  
Watts  
@ T 25°C  
L
Forward Surge Current (2)  
I
200  
Amps  
FSM  
@ T = 25°C  
A
Thermal Resistance from Junction to Lead (typical)  
Operating and Storage Temperature Range  
R
15  
°C/W  
°C  
JL  
T , T  
J
– 55 to +150  
stg  
NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above T = 25°C per Figure 3.  
A
NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.  
Semiconductor Components Industries, LLC, 1999  
1
Publication Order Number:  
December, 1999 – Rev. 2  
1.5SMC6.8AT3/D  

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