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MC14008BCP PDF预览

MC14008BCP

更新时间: 2024-11-04 04:59:35
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 运算电路逻辑集成电路光电二极管
页数 文件大小 规格书
8页 258K
描述
4-Bit Full Adder

MC14008BCP 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:DIP包装说明:DIP, DIP16,.3
针数:16Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.42
其他特性:FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING系列:4000/14000/40000
JESD-30 代码:R-PDIP-T16JESD-609代码:e0
长度:19.175 mm负载电容(CL):50 pF
逻辑集成电路类型:ADDER/SUBTRACTOR位数:4
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:5/15 V传播延迟(tpd):800 ns
认证状态:Not Qualified座面最大高度:4.44 mm
子类别:Arithmetic Circuits最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

MC14008BCP 数据手册

 浏览型号MC14008BCP的Datasheet PDF文件第2页浏览型号MC14008BCP的Datasheet PDF文件第3页浏览型号MC14008BCP的Datasheet PDF文件第4页浏览型号MC14008BCP的Datasheet PDF文件第5页浏览型号MC14008BCP的Datasheet PDF文件第6页浏览型号MC14008BCP的Datasheet PDF文件第7页 
SEMICONDUCTOR TECHNICAL DATA  
L SUFFIX  
CERAMIC  
CASE 620  
The MC14008B 4–bit full adder is constructed with MOS P–channel and  
N–channel enhancement mode devices in a single monolithic structure. This  
device consists of four full adders with fast internal look–ahead carry output.  
It is useful in binary addition and other arithmetic applications. The fast  
parallel carry output bit allows high–speed operation when used with other  
adders in a system.  
P SUFFIX  
PLASTIC  
CASE 648  
Look–Ahead Carry Output  
Diode Protection on All Inputs  
All Outputs Buffered  
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
Capable of Driving Two Low–power TTL Loads or One Low–power  
Schottky TTL Load Over the Rated Temperature Range  
Pin–for–Pin Replacement for CD4008B  
D SUFFIX  
SOIC  
CASE 751B  
ORDERING INFORMATION  
MC14XXXBCP  
MC14XXXBCL  
MC14XXXBD  
Plastic  
Ceramic  
SOIC  
MAXIMUM RATINGS* (Voltages Referenced to V  
)
SS  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Unit  
V
V
DD  
– 0.5 to + 18.0  
T
A
= – 55° to 125°C for all packages.  
V , V  
in out  
Input or Output Voltage (DC or Transient)  
– 0.5 to V  
DD  
+ 0.5  
V
l , l  
in out  
Input or Output Current (DC or Transient),  
per Pin  
± 10  
mA  
TRUTH TABLE  
(One Stage)  
P
D
Power Dissipation, per Package†  
Storage Temperature  
500  
mW  
C
C
B
A
C
S
in  
out  
T
stg  
– 65 to + 150  
260  
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
1
0
1
1
0
T
L
Lead Temperature (8–Second Soldering)  
C
* Maximum Ratings are those values beyond which damage to the device may occur.  
Temperature Derating:  
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C  
Ceramic “L” Packages: – 12 mW/ C From 100 C To 125 C  
1
1
1
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
BLOCK DIAGRAM  
HIGH–SPEED  
PARALLEL CARRY  
14  
C
out  
PIN ASSIGNMENT  
A4  
B3  
1
2
16  
15  
V
DD  
B4  
B4 15  
ADDER  
4
13 S4  
12 S3  
11 S2  
10 S1  
A4  
1
A3  
B2  
A2  
B1  
A1  
3
4
5
6
7
8
14  
13  
12  
11  
10  
9
C
out  
C4  
S4  
S3  
S2  
S1  
B3  
A3  
2
3
ADDER  
3
C3  
B2  
A2  
4
ADDER  
2
5
V
C
in  
SS  
C2  
B1  
A1  
6
7
ADDER  
1
V
V
= PIN 16  
= PIN 8  
DD  
SS  
C
9
in  
REV 3  
1/94  
Motorola, Inc. 1995  

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