Datasheet > MC10SX1130_06

MC10SX1130_06

更新时间： 2024-09-26 04:41:03

品牌	Logo	应用领域
安森美 - ONSEMI		驱动器
页数	文件大小	规格书
9页	151K
描述
LED Driver

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

MC10SX1130_06 数据手册

MC10SX1130

LED Driver

Description

The MC10SX1130 is high speed LED Driver/current switch

specifically targeted for use in FDDI PMD and ANSI X3T9.3

FibreChannel 266 Mbits/s optical transmitters. The integrated circuit

contains several unique functional blocks which makes it easily

configurable for use with a variety of high performance LED devices.

The part is fabricated using MOSAIC III™ bipolar process. The logic

is designed so that a data HIGH input results in the modulation current

http://onsemi.com

LED DRIVER

flowing through the I

pin to turn on the LED.

OUT

The device incorporates open collector outputs with a capability of

driving peak currents of 100 mA. Since the output current switching

circuitry simply switches current between the complementary outputs,

the dynamic switching demands on the system power supply are

greatly reduced. In addition, because the design is pure bipolar, the

device current drain is insensitive to the data pattern and frequency of

operation.

SOIC−16

D SUFFIX

CASE 751B

The LED drive current is adjustable through the selection of an

external set resistor, RSET. In addition, to allow for open loop

compensation for the LED’s negative optical output power tracking

over temperature, a circuit is included to provide an adjustable positive

temperature tracking coefficient to the LED drive current. This is

controlled through the selection of an external resistor, RTCO.

The MC10SX1130 incorporates novel pulse stretching circuitry

which is intended to compensate for the turn-on delay and rise and fall

time asymmetry inherent in LED devices. The stretch circuitry can be

used to pre-distort the input signal pulse width to minimize the duty

cycle distortion of the transmitted optical eye pattern. The stretch

circuitry supports three different selections of pre-distortion. This

choice is accomplished through a unique ‘tri-state’ input which can be

MARKING DIAGRAM

10SX1130G

AWLYWW

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

left open, tied to V , or tied to V to determine the pre-distortion

amount.

The device provides a V output for either single-ended use or as a

DC bias for AC coupling the signal into the device. The V pin

should only be used as a bias for the MC10SX1130 as its current

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 8 of this data sheet.

sink/source capability is limited. Whenever used, the V pin should

be bypassed to ground via a 0.01 mF capacitor.

Features

• Differential Data Inputs

• Thermally Enhanced 16-Lead SOIC Package

• 75 kW Data Input Pulldown Resistors

• +5 V or −5.2 V Operation

• 300 MHz Operation

• 100 mA Peak Drive Current

• Extremely Low Jitter

• Duty Cycle Distortion Compensation

• Adjustable Output Current Tracking With Temperature

• V Reference Available

• Pb−Free Packages are Available*

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

January, 2006 − Rev. 3

MC10SX1130/D

12 3 4 5 6 7...9

中文翻译

下载PDF

与MC10SX1130_06相关器件

型号	品牌	获取价格	描述	数据表
MC10SX1130D	ONSEMI	获取价格	LED Driver
MC10SX1130D	MOTOROLA	获取价格	LED Driver
MC10SX1130DG	ONSEMI	获取价格	LED Driver
MC10SX1130DR2	ONSEMI	获取价格	LED Driver
MC10SX1130DR2G	ONSEMI	获取价格	LED Driver
MC10SX1189	ONSEMI	获取价格	FIBRE CHANNEL COAXIAL CABLE DRIVER AND LOOP RESILIENCY CIRCUIT
MC10SX1189_06	ONSEMI	获取价格	Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit
MC10SX1189D	ONSEMI	获取价格	Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit
MC10SX1189D	MOTOROLA	获取价格	FIBRE CHANNEL COAXIAL CABLE DRIVER AND LOOP RESILIENCY CIRCUIT
MC10SX1189DG	ONSEMI	获取价格	Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit

与MC10SX1130_06相关文章

塔塔电子与力积电达成技术转让协议，携手建设印度首座晶圆厂
2024-09-29

9
英特尔震撼发布：128核心256线程的至强6性能核处理器
2024-09-29

8
SK海力士量产12层HBM3E，容量高达36GB
2024-09-27

12
意法半导体传感器驱动Sphere，开启沉浸式电影新时代
2024-09-27

19

产品中心

服务支持

精选活动

关于我们

帮助中心

MC10SX1130_06

MC10SX1130_06 数据手册

与MC10SX1130_06相关器件

与MC10SX1130_06相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MC10SX1130_06

MC10SX1130_06 数据手册

与MC10SX1130_06相关器件

与MC10SX1130_06相关文章

您还可以找

您在本页遇到什么问题？