Datasheet > MBRP40045CTLG

MBRP40045CTLG

更新时间： 2024-09-15 04:16:39

品牌	Logo	应用领域
安森美 - ONSEMI		开关
页数	文件大小	规格书
3页	117K
描述
POWERTAP II SWITCHMODE Power Rectifier

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中文翻译

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数据手册

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MBRP40045CTLG 数据手册

MBRP40045CTL

POWERTAPt II

SWITCHMODEt Power

Rectifier

These state−of−the−art devices use the Schottky Barrier principle

with a platinum barrier metal.

http://onsemi.com

Features

SCHOTTKY

BARRIER RECTIFIER

400 AMPERES

45 VOLTS

• Dual Diode Construction; May be Paralleled for Higher Current Output

• Guard−Ring for Stress Protection

• Low Forward Voltage Drop

• 150°C Operating Junction Temperature

• Recyclable Epoxy

• Guaranteed Reverse Avalanche Energy Capability

• Improved Mechanical Ratings

• Pb−Free Package is Available*

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RRM

RWM

Average Rectified Forward Current

F(AV)

POWERTAP II

CASE 357C

PLASTIC

(At Rated V , T = 100°C)

Per Leg

200

400

Per Device

Peak Repetitive Forward Current

(At Rated V , Square Wave,

400

FRM

20 kHz, T = 100°C)

MARKING DIAGRAM

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions

Halfwave, Single Phase, 60 Hz)

2500

FSM

RRM

MCC

AYYWWG

Peak Repetitive Reverse Current

(2.0 ms, 1.0 kHz)

2.0

B40045L

Storage and Operating Case

Temperature Range

stg

, T

−55 to +150

°C

B40045L = Specific Device Code

Operating Junction Temperature

−55 to +150

°C

MCC

= Mold Compound Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

Voltage Rate of Change (Rated V )

dv/dt

1000

V/ms

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

ORDERING INFORMATION

Device

Package

Shipping

POWERTAP II

MBRP40045CTL

25 Units/Tray

MBRP40045CTLG POWERTAP II 25 Units/Tray

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

(Pb−Free)

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

September, 2006 − Rev. 3

MBRP40045CTL/D

12 3

中文翻译

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