MBRB20100CT
SWITCHMODEt
Power Rectifier
D2PAK Surface Mount Power Package
2
The D PAK Power Rectifier is a state−of−the−art device that
employs the use of the Schottky Barrier principle with a platinum
barrier metal.
http://onsemi.com
Features
SCHOTTKY BARRIER
RECTIFIER
• Package Designed for Power Surface Mount Applications
• Center−Tap Configuration
• Guardring for Stress Protection
• Low Forward Voltage
20 AMPERES
100 VOLTS
• 175°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Short Heat Sink Tab Manufactured − Not Sheared!
• Similar in Size to Industry Standard TO−220 Package
• Pb−Free Packages are Available
1
4
3
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.4 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
2
4
D PAK
CASE 418B
STYLE 3
• Lead and Mounting Surface Temperature for Soldering Purposes:
1
3
260°C Max. for 10 Seconds
• Device Meets MSL1 Requirements
• ESD Ratings: Machine Model, C >400 V
Human Body Model, 3B >8000 V
MARKING DIAGRAM
MAXIMUM RATINGS (Per Leg)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
100
V
RRM
RWM
AY WW
B20100G
AKA
R
Average Rectified Forward Current
I
10
20
A
A
A
F(AV)
(Rated V , T = 110°C) Total Device
R
C
Peak Repetitive Forward Current (Rated
V , Square Wave, 20 kHz, T = 100°C)
I
20
FRM
R
C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
150
FSM
A
Y
= Assembly Location
= Year
WW
= Work Week
Peak Repetitive Reverse Surge Current
(2.0 ms, 1.0 kHz)
I
0.5
A
RRM
B20100 = Device Code
G
AKA
= Pb−Free Package
= Diode Polarity
Storage Temperature Range
T
−65 to +175
−65 to +175
10,000
°C
°C
stg
Operating Junction Temperature (Note 1)
T
J
Voltage Rate of Change (Rated V )
dv/dt
V/ms
R
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
May, 2009 − Rev. 8
MBRB20100CT/D