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MBRAF2H100 PDF预览

MBRAF2H100

更新时间: 2024-01-18 08:18:02
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 63K
描述
Surface Mount Schottky Power Rectifier

MBRAF2H100 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.74
配置:SINGLE二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.65 V最大非重复峰值正向电流:130 A
元件数量:1最高工作温度:175 °C
最大输出电流:2 A最大重复峰值反向电压:100 V
子类别:Rectifier Diodes表面贴装:YES
技术:SCHOTTKYBase Number Matches:1

MBRAF2H100 数据手册

 浏览型号MBRAF2H100的Datasheet PDF文件第2页浏览型号MBRAF2H100的Datasheet PDF文件第3页浏览型号MBRAF2H100的Datasheet PDF文件第4页浏览型号MBRAF2H100的Datasheet PDF文件第5页 
MBRAF2H100  
Surface Mount  
Schottky Power Rectifier  
This device employs the Schottky Barrier principle in a large area  
metal−to−silicon power diode. State−of−the−art geometry features  
epitaxial construction with oxide passivation and metal overlay  
contact. Ideally suited for low voltage, high frequency rectification, or  
as free wheeling and polarity protection diodes in surface mount  
applications where compact size and weight are critical to the system.  
www.onsemi.com  
SCHOTTKY BARRIER  
RECTIFIER  
Features  
2.0 AMPERE  
100 VOLTS  
Low Profile Package for Space Constrained Applications  
Rectangular Package for Automated Handling  
Highly Stable Oxide Passivated Junction  
150°C Operating Junction Temperature  
Guard−Ring for Stress Protection  
These are Pb−Free and Halide−Free Devices  
SMA−FL  
CASE 403AA  
STYLE 6  
Mechanical Charactersistics  
Case: Epoxy, Molded, Epoxy Meets UL 94, V−0  
Weight: 95 mg (approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
MARKING DIAGRAM  
Leads are Readily Solderable  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
Cathode Polarity Band  
RAA  
AYWWG  
Device Meets MSL 1 Requirements  
ESD Ratings: Machine Model = C  
ESD Ratings: Human Body Model = 3B  
RAA  
A
Y
WW  
G
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= Pb−Free Package  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MBRAF2H100T3G SMA−FL 5000 / Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
December, 2014 − Rev. 3  
MBRAF2H100/D  

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