Green
MB08F(LS)
GLASS PASSIVATED
REVERSE VOLTAGE – 1000 Volts
SURFACE MOUNT BRIDGE RECTIFIER
FORWARD CURRENT – 0.8 Ampere
FEATURES
• Glass Passivated Chip Junction
• Reverse Voltage – 1000 V
MBF
MBF
• Forward Current – 0.8 A
DIM MIN MAX
• High Surge Current Capability
• Designed for Surface Mount Application
• UL recognized file#E364304
• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device
(Note 3)
A
C
D
E
1.20 1.60
0.15 0.22
4.50 5.00
3.60 4.10
-
+
HE 6.40 7.00
d
e
L
2.30 2.70
0.50 0.70
1.30 1.70
L1 0.50 1.10
MECHANICAL DATA
a
-
0.2
• Package Material: MBF
∠
7° TYP.
• Terminals: Solderable per MIL-STD-750, Method 2026
• Weight: 75 mg (Approximate)
• Marking: MB08F
All dimension in
millimeter
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
ABSOLUTE RATINGS
PARAMETER
SYMBOL
VALUE
UNIT
Maximum repetitive peak reverse voltage
Maximum DC blocking voltage
VRRM
VDC
1000
1000
0.8
V
V
A
Average rectified output current per device
I(AV)
Peak forward surge current 8.3ms single half
sine-wave superimposed on rated load
@ TA=25°C
IFSM
25
A
Operating and storage temperature range
TJ ,TSTG
-55 to +150
°C
STATIC ELECTRICAL CHARACTERISTICS
PARAMETER
Forward voltage
Leakage current
TEST CONDITION
SYMBOL
VALUE
UNIT
IF = 0.4A
IF = 0.8A
TA = 25°C
TA = 25°C
TA = 25°C
TA = 125°C
1.0
1.1
5
VF
V
VR = 1000V
IR
uA
pF
500
Typical junction capacitance (Note 4)
CJ
13
THERMAL CHARACTERISTICS
PARAMETER
SYMBOL
VALUE
UNIT
RthJC
RthJA
RthJL
50
90
60
Typical thermal resistance (Note 5)
°C/W
Notes:
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony
compounds.
4. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
5. Thermal resistance junction to case, lead and ambient in accordance with JESD-51. Unit mounted on glass-epoxy PC board with 2.7 X 3.7mm2 copper pad per pin.
1 of 4
www.diodes.com
January 2022
© Diodes Incorporated
MB08F(LS)
Document number: DS44600 Rev. 3 - 2