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5.5V Input, 0.4A/1.05A Switching Current
MAX77837
Buck-Boost Converter with 400nA IQ
Benefits and Features
General Description
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•
•
•
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•
1.8V to 5.5V Input Voltage
Output Voltages Combination from 1.8V to 5.2V
The MAX77837 is the industry's smallest nanoPower
buck-boost converter optimized for single-cell battery
chemistries that are used in wearable and Internet of
Things (IoT) applications.
Peak Efficiency of 95% (5.5V , 3.8V
IN
)
OUT
430nA Typical Quiescent current
10nA Shutdown Current
The converter operates on an input supply between 1.8V
to 5.5V. Output voltages between 1.8V to 5.2V are set
through resistors connected to two hardware control pins.
The IC can operate in Continuous Conduction Mode
(CCM), Skip Mode, and a Low-Power Mode to ensure high
efficiency over a wide load current range. In addition, the
IC features an ultra-low quiescent current of 430nA
(typical) and a shutdown current of 10nA (typical), making
it ideal for battery-powered applications requiring a long
standby time.
R
SEL
Configurations
• OUT1 and OUT2
• 1.05A or 0.4A Switch Current Limit
• DVS Function On or Off
• Hiccup or Latch-Off Mode
•
Protections Features
• Input Undervoltage Lockout (UVLO)
• Overcurrent protection (OCP)
• Thermal Shutdown
The MAX77837 offers two unique hardware control pins,
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•
1.84mm x 1.03mm, 8-Bump WLP
2.5mm x 2.0mm, 8-Lead FC2QFN
SEL1 and SEL2. The resistor connected at SEL1 (R
)
SEL1
selects a predefined combination of two output voltages
between 1.8V to 5.2V, OUT1 and OUT2. The resistor
connected at SEL2 (R
) allows two different
SEL2
Applications
configurations of switch current limit at 1050mA and
400mA to optimize external component size, enable or
disable Dynamic Voltage Scaling (DVS) function, and
select either hiccup or latch-off mode during a hard short
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LPWAN SoC Companion Power Solution
IoT and Wearable Applications
Asset Trackers
event. R
can also configure the startup voltage as
Smart Meters
SEL2
OUT1 or OUT2, and the DVS function can change the
output voltage from a lower V to a higher V as
OUT
required without powering down the part.
OUT
Ordering Information appears at end of the data sheet
The MAX77837 is available in both a 1.84mm x 1.03mm,
8-bump wafer-level package (WLP) with a bump pitch of
0.4mm and a 2.5mm x 2.0mm, 8-lead Flip Chip QFN
package (FC2QFN).
Simplified Application Circuit
2.2µH
RSEL1
0402
RSEL2
0402
LX1
LX2
OUT
1.8V TO 5.5V
DC SOURCE
V
OUT
IN
1.8V TO 5.2V
C
IN
C
OUT
10V, X7R
10V, X7R
0603, 10µF
0805, 22µF
MAX77837
ENABLE
EN
SEL1
L
2.0mm x 1.5mm
DVS
R
SEL1
SEL2
R
SEL2
PGND
6.2mm
19-101627; Rev 0; 2/23
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