Datasheet > MAX708MJA/883B

MAX708MJA/883B

更新时间： 2024-02-13 03:17:25

品牌	Logo	应用领域
美信 - MAXIM		/
页数	文件大小	规格书
5页	31K
描述
Power Supply Management Circuit, Fixed, 1 Channel, CMOS, CDIP8, CERAMIC, DIP-8

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技术参数
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MAX708MJA/883B 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	零件包装代码：	DIP
包装说明：	DIP, DIP8,.3	针数：	8
Reach Compliance Code：	not_compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	Factory Lead Time：	18 weeks
风险等级：	5.11	可调阈值：	NO
模拟集成电路 - 其他类型：	POWER SUPPLY MANAGEMENT CIRCUIT	JESD-30 代码：	R-GDIP-T8
JESD-609代码：	e0	湿度敏感等级：	1
信道数量：	1	功能数量：	1
端子数量：	8	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP	封装等效代码：	DIP8,.3
封装形状：	RECTANGULAR	封装形式：	IN-LINE
峰值回流温度（摄氏度）：	245	电源：	5 V
认证状态：	Not Qualified	筛选级别：	MIL-STD-883 Class B
座面最大高度：	5.08 mm	子类别：	Power Management Circuits
最大供电电流 (Isup)：	0.5 mA	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	1.2 V	标称供电电压 (Vsup)：	5 V
表面贴装：	NO	技术：	CMOS
温度等级：	MILITARY	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	THROUGH-HOLE	端子节距：	2.54 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.62 mm	Base Number Matches：	1

MAX708MJA/883B 数据手册

SCOPE:

MICROPROCESSOR SUPERVISORY CIRCUITS

Device Type

Generic Number

MAX705(x)/883B

MAX706(x)/883B

MAX707(x)/883B

MAX708(x)/883B

MAX813L(x)/883B

Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:

Outline Letter

MAXIM SMD

Mil-Std-1835

Case Outline

Package Code

GDIP1-T08 or CDIP2-T08

CQCC1-N20

8 LEAD CERDIP

20 Pin Leadless Chip

J08

L20

Absolute Maximum Ratings

Terminal Voltage (with respect to GND)

V_CC.................................................................................................................. -0.3V to +6.0V

All other Inputs 1/ .................................................................................. -0.3V to (Vcc+0.3V)

Input Current

V_CC................................................................................................................................. 10mA

GND ............................................................................................................................... 10mA

Output Current (all outputs) ............................................................................................... 10mA

Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C

Storage Temperature ......................................................................................... -65°C to +160°C

Continuous Power Dissipation ................................................................................... T_A=+70°C

8 lead CERDIP(derate 8.0mW/°C above +70°C) ...................................................... 640mW

20 lead LCC(derate 9.1mW/°C above +70°C) .......................................................... 727mW

Junction Temperature T_J............................................................................................. +150°C

Thermal Resistance, Junction to Case, ΘJC:

Case Outline 8 lead CERDIP........................................................................ 55°C/W

Case Outline 20 leadless Chip carrier .......................................................... 20°C/W

Thermal Resistance, Junction to Ambient, ΘJA:

Case Outline 8 lead CERDIP...................................................................... 125°C/W

Case Outline 20 leadless Chip carrier ........................................................ 110°C/W

Recommended Operating Conditions

Ambient Operating Range (T_A) ............................................................... -55°C to +125°C

Supply Voltage Range (V_CC) ...................................................................... +1.2V to +5.5V

___

NOTE 1: The input voltage limits on PFI and MR may be exceeded if the input current is less than 10mA.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

----------------------------

Electrical Characteristics of MAX705/706/707/708/813L/883B 19-0216

for /883B and SMD 5962-93267 Page 2 of

Rev. C

12 3 4 5

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与MAX708MJA/883B相关器件

型号	品牌	获取价格	描述	数据表
MAX708R	MAXIM	获取价格	+3V Voltage Monitoring.Low-Cost.µ.P Supervisory Circuits
MAX708R	ADI	获取价格	监视+3V电压、低成本、微处理器监控电路
MAX708R/S/T	MAXIM	获取价格	3 V microprocessor supervisor circuit with power fail comparator and manual reset
MAX708RCPA	MAXIM	获取价格	+3V Voltage Monitoring, Low-Cost, レP Supervis
MAX708RCPA+	MAXIM	获取价格	Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTI
MAX708RCSA	MAXIM	获取价格	+3V Voltage Monitoring, Low-Cost, レP Supervis
MAX708RCSA+	MAXIM	获取价格	Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO8, 0.150 INCH, LEAD FREE, MS-012
MAX708RCSA-T	MAXIM	获取价格	Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOP-8
MAX708RCUA	MAXIM	获取价格	+3V Voltage Monitoring, Low-Cost, レP Supervis
MAX708RCUA-T	MAXIM	获取价格	Analog IC

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