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MAX693MJE/883B PDF预览

MAX693MJE/883B

更新时间: 2024-11-29 13:11:03
品牌 Logo 应用领域
美信 - MAXIM 监控
页数 文件大小 规格书
16页 884K
描述
Power Supply Management Circuit, Fixed, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16

MAX693MJE/883B 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:DIP
包装说明:CERAMIC, DIP-16针数:16
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.1
可调阈值:NO模拟集成电路 - 其他类型:POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码:R-GDIP-T16JESD-609代码:e0
湿度敏感等级:1信道数量:1
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):245
电源:5 V认证状态:Not Qualified
筛选级别:MIL-STD-883 Class B座面最大高度:5.842 mm
子类别:Power Management Circuits最大供电电流 (Isup):10 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

MAX693MJE/883B 数据手册

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