Datasheet > MAX694MFB/883B

MAX694MFB/883B

更新时间： 2024-02-28 11:19:47

品牌	Logo	应用领域
美信 - MAXIM		/
页数	文件大小	规格书
6页	33K
描述
Power Management Circuit, CMOS, CDFP10, FP-10

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

MAX694MFB/883B 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	FP-10	Reach Compliance Code：	not_compliant
风险等级：	5.92	JESD-30 代码：	R-XDFP-F10
端子数量：	10	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	CERAMIC
封装代码：	DFP	封装等效代码：	FL10,.3
封装形状：	RECTANGULAR	封装形式：	FLATPACK
电源：	5 V	认证状态：	Not Qualified
筛选级别：	38535Q/M;38534H;883B	子类别：	Power Management Circuits
最大供电电流 (Isup)：	15 mA	标称供电电压 (Vsup)：	5 V
表面贴装：	YES	技术：	CMOS
温度等级：	MILITARY	端子形式：	FLAT
端子节距：	1.27 mm	端子位置：	DUAL
Base Number Matches：	1

MAX694MFB/883B 数据手册

SCOPE:

MICROPROCESSOR SUPERVISORY CIRCUITS

Device Type

Generic Number

MAX690(x)/883B

MAX691(x)/883B

MAX692(x)/883B

MAX693(x)/883B

MAX694(x)/883B

MAX695(x)/883B

Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:

Outline Letter

MAXIM SMD

Mil-Std-1835

Case Outline

Package Code

GDIP1-T08 or CDIP2-T08

GDIP1-T16 or CDIP2-T16

CDFP3-F10

8 LEAD CERDIP

J08

16 LEAD CERDIP

10 LEAD Flatpack

20 Pin Leadless Chip

J16

F10

L20

CQCC1-N20

Absolute Maximum Ratings

Terminal Voltage (with respect to GND)

V_CC.................................................................................................................. -0.3V to +6.0V

_BATT................................................................................................................ -0.3V to+6.0V

All other Inputs 1/ ................................................................................. -0.3V to (V_OUT+0.5V)

Input Current

_CC............................................................................................................................... 200mA

V_BATT.............................................................................................................................. 50mA

GND ............................................................................................................................... 20mA

Output Current

_OUT.................................................................................................. Short-circuit protected

All other outputs ........................................................................................................... 20mA

Rate of Rise, V_CC, V_BATT................................................................................................ 100V/µs

Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C

Storage Temperature ......................................................................................... -65°C to +160°C

Continuous Power Dissipation ................................................................................... T_A=+70°C

8 lead CERDIP(derate 8.0mW/°C above +70°C) ..................................................... 640mW

16 lead CERDIP(derate 10.0mW/°C above +70°C) ................................................. 800mW

10 lead Flatpack(derate 5.3mW/°C above +70°C) ................................................... 421mW

20 lead LCC(derate 9.1mW/°C above +70°C) ......................................................... 727mW

Junction Temperature T_J............................................................................................ +150°C

Thermal Resistance, Junction to Case, ΘJC:

Case Outline 8 lead CERDIP..................................................................... 55°C/W

Case Outline 16 lead CERDIP................................................................... 50°C/W

Case Outline 10 lead Flatpack .................................................................. 85°C/W

Case Outline 20 leadless Chip carrier ....................................................... 20°C/W

Thermal Resistance, Junction to Ambient, ΘJA:

Case Outline 8 lead CERDIP................................................................... 125°C/W

Case Outline 16 lead CERDIP................................................................. 100°C/W

Case Outline 10 lead Flatpack ................................................................ 190°C/W

Case Outline 20 leadless Chip carrier ..................................................... 110°C/W

NOTE 1: The input voltage limits on PFI and WDI may be exceeded if the input current is less than 10mA.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

----------------------------

Electrical Characteristics of MAX690/691/692/693/694

/695/883B for /883B and SMD 5962-90711 and 5962-90712

19-2553

Page 2 of

Rev. C

12 3 4 5 6

中文翻译

下载PDF

与MAX694MFB/883B相关器件

型号	品牌	获取价格	描述	数据表
MAX694MJA	MAXIM	获取价格	Microprocessor Supervisory Circuits
MAX694MJA	ROCHESTER	获取价格	Power Supply Management Circuit, Adjustable, 1 Channel, CDIP8, CEDIP-8
MAX694MJA/883	MAXIM	获取价格	Power Supply Supervisor
MAX694MJA/883B	MAXIM	获取价格	Power Supply Management Circuit, Fixed, 1 Channel, CMOS, CDIP8, CERDIP-8
MAX694MJA/HR	MAXIM	获取价格	Power Supply Supervisor
MAX694MJA+	MAXIM	获取价格	暂无描述
MAX695	MAXIM	获取价格	Microprocessor Supervisory Circuits
MAX695	ADI	获取价格	微处理器监控电路
MAX6950	MAXIM	获取价格	Serially Interfaced, +2.7V to +5.5V, 5- and 8-Digit LED Display Drivers
MAX6950	ADI	获取价格	串行接口、+2.7V至+5.5V、5位或8位LED显示驱动器

与MAX694MFB/883B相关文章

Pickering新高压舌簧继电器亮相汽车测试博览会
2024-08-26

17
采用MCU+MPU双处理器架构实现的创新应用设计探索
2024-08-23

34
解读L9904TR手册资料：产品概述、主要功能、电气参数
2024-08-20

33
芯片底部填充工艺：提升电子设备可靠性的关键步骤
2024-08-14

92

产品中心

服务支持

精选活动

关于我们

帮助中心

MAX694MFB/883B

MAX694MFB/883B 技术参数

MAX694MFB/883B 数据手册

与MAX694MFB/883B相关器件

与MAX694MFB/883B相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MAX694MFB/883B

MAX694MFB/883B 技术参数

MAX694MFB/883B 数据手册

与MAX694MFB/883B相关器件

与MAX694MFB/883B相关文章

您还可以找

您在本页遇到什么问题？