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MAX694MJA/883B PDF预览

MAX694MJA/883B

更新时间: 2024-11-15 21:20:11
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
6页 39K
描述
Power Supply Management Circuit, Fixed, 1 Channel, CMOS, CDIP8, CERDIP-8

MAX694MJA/883B 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:DIP
包装说明:CERDIP-8针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.11
可调阈值:NO模拟集成电路 - 其他类型:POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码:R-GDIP-T8JESD-609代码:e0
湿度敏感等级:1信道数量:1
功能数量:1端子数量:8
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DIP
封装等效代码:DIP8,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):245
电源:5 V认证状态:Not Qualified
筛选级别:38535Q/M;38534H;883B座面最大高度:5.08 mm
子类别:Power Management Circuits最大供电电流 (Isup):15 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

MAX694MJA/883B 数据手册

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SCOPE:  
MICROPROCESSOR SUPERVISORY CIRCUITS  
Device Type  
Generic Number  
MAX690(x)/883B  
MAX691(x)/883B  
MAX692(x)/883B  
MAX693(x)/883B  
MAX694(x)/883B  
MAX695(x)/883B  
01  
02  
03  
04  
05  
06  
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:  
Outline Letter  
MAXIM SMD  
Mil-Std-1835  
Case Outline  
Package Code  
JA  
JE  
FB  
LP  
P
E
X
2
GDIP1-T08 or CDIP2-T08  
GDIP1-T16 or CDIP2-T16  
CDFP3-F10  
8 LEAD CERDIP  
J08  
16 LEAD CERDIP  
10 LEAD Flatpack  
20 Pin Leadless Chip  
J16  
F10  
L20  
CQCC1-N20  
Absolute Maximum Ratings  
Terminal Voltage (with respect to GND)  
VCC .................................................................................................................. -0.3V to +6.0V  
BATT ................................................................................................................ -0.3V to+6.0V  
V
All other Inputs 1/ ................................................................................. -0.3V to (VOUT+0.5V)  
Input Current  
V
CC ............................................................................................................................... 200mA  
VBATT .............................................................................................................................. 50mA  
GND ............................................................................................................................... 20mA  
Output Current  
V
OUT .................................................................................................. Short-circuit protected  
All other outputs ........................................................................................................... 20mA  
Rate of Rise, VCC, VBATT ................................................................................................ 100V/µs  
Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C  
Storage Temperature ......................................................................................... -65°C to +160°C  
Continuous Power Dissipation ................................................................................... TA=+70°C  
8 lead CERDIP(derate 8.0mW/°C above +70°C) ..................................................... 640mW  
16 lead CERDIP(derate 10.0mW/°C above +70°C) ................................................. 800mW  
10 lead Flatpack(derate 5.3mW/°C above +70°C) ................................................... 421mW  
20 lead LCC(derate 9.1mW/°C above +70°C) ......................................................... 727mW  
Junction Temperature TJ ............................................................................................ +150°C  
Thermal Resistance, Junction to Case, ΘJC:  
Case Outline 8 lead CERDIP..................................................................... 55°C/W  
Case Outline 16 lead CERDIP................................................................... 50°C/W  
Case Outline 10 lead Flatpack .................................................................. 85°C/W  
Case Outline 20 leadless Chip carrier ....................................................... 20°C/W  
Thermal Resistance, Junction to Ambient, ΘJA:  
Case Outline 8 lead CERDIP................................................................... 125°C/W  
Case Outline 16 lead CERDIP................................................................. 100°C/W  
Case Outline 10 lead Flatpack ................................................................ 190°C/W  
Case Outline 20 leadless Chip carrier ..................................................... 110°C/W  
NOTE 1: The input voltage limits on PFI and WDI may be exceeded if the input current is less than 10mA.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
----------------------------  
Electrical Characteristics of MAX690/691/692/693/694  
/695/883B for /883B and SMD 5962-90711 and 5962-90712  
19-2553  
Page 2 of  
Rev. C  
8

MAX694MJA/883B 替代型号

型号 品牌 替代类型 描述 数据表
MAX694MJA MAXIM

完全替代

Microprocessor Supervisory Circuits
MAX690EJA MAXIM

完全替代

Microprocessor Supervisory Circuits
MAX690MJA/883B MAXIM

类似代替

Power Supply Management Circuit, Fixed, 1 Channel, CMOS, CDIP8, CERDIP-8

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