是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, SOP8,.25 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | 风险等级: | 1.26 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.9 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.75 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.05 mA |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3.9 mm | Base Number Matches: | 1 |
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