MAX20340
Bidirectional DC Powerline
Communication Management IC
Functional Diagram
V
CC
Q2
Q1
R
R
ON_Q2
ON_Q1
MAX20340
LDO
(ONLY IN SLAVE MODE,
BYPASSED OTHERWISE)
BAT
PLC
V
CCINT
SELECTOR
I
PLC_SNK
V
BAT_RECHG
V
CCINT
HIGH PSRR
INTERNAL SUPPLY
VOLTAGE
CLAMP
SDA
SCL
MASTER/SLAVE
PLC CONFIG AND
CONTROL
PEAK
DETECTOR
2
I
C
BAT
GND
DAC
REF
RSEL
Absolute Maximum Ratings
V
, PLC, SCL, SDA,
BAT,
, RSEL to GND…. ................................................................................................... -0.3V to +6V
CC
Continuous Current V , Q1, Q2 closed, PLC...............................................................................................................-1.2A to +1.2A
CC
Continuous
Current
into
Any
Other
Terminal
...................................................................................................................................................................................-20mA to +20mA
Continuous Power Dissipation (Multilayer Board) (TA = 70°C, derate 11.91mW/°C above +70°C)........................................ 952.8mW
Operating Temperature Range..................................................................................................................................... -40°C to +85°C
Junction Temperature............................................................................................................................................................... +150°C
Storage Temperature Range...................................................................................................................................... -40°C to +150°C
Soldering Temperature (reflow)................................................................................................................................................ +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Package Information
9 WLP
Package Code
W91R1+1
21-100389
Outline Number
Land Pattern Number
Refer to Application Note 1891
Thermal Resistance, Four Layer Board:
Junction-to-Ambient (θJA)
Junction-to-Case Thermal Resistance (θJC)
83.98°C/W
N/A
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layerboard. For
detailed information on package thermal considerations see www.maxim-ic.com/thermal-tutorial.
www.maximintegrated.com
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