是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA12,3X4,20 | 针数: | 12 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 1.6 | 接口集成电路类型: | INTERFACE CIRCUIT |
JESD-30 代码: | R-PBGA-B12 | JESD-609代码: | e3 |
长度: | 2.12 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 12 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA12,3X4,20 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5/3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 0.67 mm | 子类别: | Other Interface ICs |
最大供电电压: | 3.2 V | 最小供电电压: | 1.62 V |
标称供电电压: | 1.8 V | 电源电压1-最大: | 3.6 V |
电源电压1-分钟: | 2.2 V | 电源电压1-Nom: | 3.3 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.54 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX13042EETD+T | MAXIM |
获取价格 |
1.62V to 3.6V Improved High-Speed LLT | |
MAX13043EEBC+ | MAXIM |
获取价格 |
Interface Circuit, BICMOS, PBGA12 | |
MAX13043EEBC+T | MAXIM |
获取价格 |
Interface Circuit, BICMOS, PBGA12, 1.54 X 2.12 MM, LEAD FREE, UCSP-12 | |
MAX13043EETD+ | MAXIM |
获取价格 |
Interface Circuit, BICMOS, PDSO14 | |
MAX13043EETD+T | MAXIM |
获取价格 |
Interface Circuit, BICMOS, PDSO14, 3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, TDFN-14 | |
MAX13044EEBC+T | MAXIM |
获取价格 |
Interface Circuit, BICMOS, PBGA12, 1.54 X 2.12 MM, LEAD FREE, UCSP-12 | |
MAX13045E | MAXIM |
获取价格 |
1.62V to 3.6V Improved High-Speed LLT | |
MAX13045EEBC+T | MAXIM |
获取价格 |
Interface Circuit, BICMOS, PBGA12, 1.54 X 2.12 MM, LEAD FREE, UCSP-12 | |
MAX13046E | MAXIM |
获取价格 |
Single- and Dual-Bidirectional Low-Level Translator | |
MAX13046E | ADI |
获取价格 |
单/双通道、双向低电压电平转换器 |