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MAT10100 PDF预览

MAT10100

更新时间: 2024-11-27 00:38:39
品牌 Logo 应用领域
泰科 - TE 衰减器射频微波
页数 文件大小 规格书
3页 460K
描述
Attenuator DIE

MAT10100 数据手册

 浏览型号MAT10100的Datasheet PDF文件第2页浏览型号MAT10100的Datasheet PDF文件第3页 
MAT10xxx Series  
Attenuator DIE  
DC - 40 GHz  
Rev. V3  
Features  
Medium Power Handling 2 W CW  
Flat Response from DC to 40 GHz  
Return Loss:  
>18 dB DC to 12 GHz  
>16 dB 13 to 40 GHz  
Space Saving Footprint:  
0.030” x 0.030” (.762 x .762 mm)  
Very Good Stability Over Temperature  
(TRC <100 PPM)  
Ground Wrap to Top  
(No ground bonding required)  
RoHS* Compliant  
Front to back metallization in 4 places  
Description  
These fixed attenuator chips are fabricated using our  
state of the art thin film metallization and advanced  
photolithography technology.  
All devices are available in chip form with a  
metalized ground connection on the back. This  
ground is wrapped around on the four corners of the  
chip so additional ground bonding ribbon is not  
required.  
Bonding pad sizes and resistor outline  
may differ from value to value.  
The chips may be attached using conductive epoxy  
or solder preform. Gold contacts on the input and  
output pads make assembly, using standard  
bonding equipment, fast and reliable. Custom values  
and configuration available on request.  
Electrical Specifications: TA = +25°C  
Part Number  
Attenuation (dB)  
Insertion Loss (dB)  
Return Loss (dB)  
MAT10010  
MAT10020  
MAT10030  
MAT10040  
MAT10050  
1
2
3
4
5
+/-0.30  
+/-0.30  
+/-0.30  
+/-0.30  
+/-0.30  
>18  
>18  
>18  
>18  
>18  
CONTINUED  
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.  
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  

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