Datasheet > MAT10140

MAT10140

更新时间： 2024-11-27 00:38:39

品牌	Logo	应用领域
泰科 - TE		衰减器射频微波
页数	文件大小	规格书
3页	460K
描述
Attenuator DIE

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数据手册

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MAT10140 数据手册

MAT10xxx Series

Attenuator DIE

DC - 40 GHz

Rev. V3

Features



Medium Power Handling 2 W CW

Flat Response from DC to 40 GHz

Return Loss:

>18 dB DC to 12 GHz

>16 dB 13 to 40 GHz



Space Saving Footprint:

0.030” x 0.030” (.762 x .762 mm)

Very Good Stability Over Temperature

(TRC <100 PPM)

Ground Wrap to Top

(No ground bonding required)

RoHS* Compliant

Front to back metallization in 4 places

Description

These fixed attenuator chips are fabricated using our

state of the art thin film metallization and advanced

photolithography technology.

All devices are available in chip form with a

metalized ground connection on the back. This

ground is wrapped around on the four corners of the

chip so additional ground bonding ribbon is not

required.

Bonding pad sizes and resistor outline

may differ from value to value.

The chips may be attached using conductive epoxy

or solder preform. Gold contacts on the input and

output pads make assembly, using standard

bonding equipment, fast and reliable. Custom values

and configuration available on request.

Electrical Specifications: T_A= +25°C

Part Number

Attenuation (dB)

Insertion Loss (dB)

Return Loss (dB)

MAT10010

MAT10020

MAT10030

MAT10040

MAT10050

+/-0.30

>18

CONTINUED

* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

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