Datasheet > MAT10190

MAT10190

更新时间： 2024-11-27 14:51:15

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
3页	283K
描述
Thin Film Attenuator Pads

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数据手册

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MAT10190 数据手册

Attenuator DIE

DC - 20 GHz

MAT10xxx Series

Rev. V5

Features

•

Medium Power Handling 2 W CW

Flat Response from DC to 20 GHz

Return Loss:

>18 dB DC to 12 GHz

>16 dB 13 to 20 GHz

•

Space Saving Footprint:

0.030” x 0.030” (0.762 x 0.762 mm)

Very Good Stability Over Temperature

(TRC <100 PPM)

Ground Wrap to Top

(No ground bonding required)

RoHS* Compliant

Front to back metallization in 4 places

Description

These fixed attenuator chips are fabricated using our

state of the art thin film metallization and advanced

photolithography technology.

All devices are available in chip form with a

metalized ground connection on the back. This

ground is wrapped around on the four corners of the

chip so additional ground bonding ribbon is not

required.

Bonding pad sizes and resistor outline

may differ from value to value.

The chips may be attached using conductive epoxy

or solder preform. Gold contacts on the input and

output pads make assembly, using standard

bonding equipment, fast and reliable. Custom values

and configuration available on request.

Electrical Specifications: T_A= +25°C

Part Number

MAT10000

MAT10010

MAT10020

MAT10030

MAT10040

MAT10050

MAT10060

MAT10070

MAT10080

Attenuation (dB)

Insertion Loss (dB)

Return Loss (dB)

+/-0.30

+/-0.35

>18

CONTINUED

* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0011352

12 3

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