Datasheet > MAFR2G

MAFR2G

更新时间： 2024-09-18 00:59:51

品牌	Logo	应用领域
钜兴 - JUXING		/
页数	文件大小	规格书
3页	1488K
描述
Surface Mount Fast Recovery Rectifiers

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中文翻译

获取价格

数据手册

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MAFR2G 数据手册

MAFR2A~MAFR2M

Surface Mount Fast Recovery Rectifiers

Features

●

Low profile package

●

Ideal for automated placement

Glass passivated chip junction

Fast switching for high efficiency

High forward surge capability

High temperature soldering：

260℃/10 seconds at terminals

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

●

Major Ratings and Characteristics

I_F(AV)

V_RRM

I_FSM

2.0 A

50 V to 1000 V

50 A

Mechanical Date

●

Case: JEDEC MSMA molded plastic

body over glass passivated chip

●

t_rr

150nS, 250nS, 500nS

1.3 V

Terminals: Solder plated, solderable per

V_F

J-STD-002B and JESD22-B102D

●

T_jmax.

150 °C

Polarity: Laser band denotes cathode end

Maximum Ratings & Thermal Characteristics

(T_A= 25 °C unless otherwise noted)

MAFR MAFR MAFR MAFR MAFR MAFR MAFR

Items

Symbol

UNIT

100

200

140

200

400

280

400

2.0

800

560

800

1000

700

V_RRM

V_RMS

V_DC

Maximum repetitive peak reverse voltage

Maximum RMS voltage

600

420

600

Maximum DC blocking voltage

100

1000

I_F(AV)

Maximum average forward rectified current

Peak forward surge current 8.3 ms single

half sine-wave superimposed on rated load

I_FSM

R_θJL

℃/W

℃

Thermal resistance from junction to lead⁽¹⁾

Operating junction and storage temperature

range

T_J，T_STG

–55 to +150

Note 1: Mounted on P.C.B. with 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas.

(T_A= 25 °C unless otherwise noted)

Electrical Characteristics

Items

MAFR2A~

MAFR2G

MAFR2K~

MAFR2M

Test conditions

Symbol

MAFR2J

UNIT

I_F=2.0A⁽²⁾

V_F

I_R

Instantaneous forward voltage

Reverse current

1.3

T_j=25℃

V_R=V^DC

100

μA

T_j=125℃

I_F= 0.5 A , I_R= 1.0 A ,

I_rr= 0.25 A

t_rr

Reverse recovery time

150

250

500

C_J

Typical junction capacitance

4.0V,1.0MHz

Note 2: Pulse test:300μs pulse width,1% duty cycle.

http://www.trr-jx.com

12 3

中文翻译

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