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MAAPGM0074-DIE PDF预览

MAAPGM0074-DIE

更新时间: 2024-11-25 02:51:11
品牌 Logo 应用领域
泰科 - TE 放大器
页数 文件大小 规格书
8页 426K
描述
Amplifier, Power, 8W 2.0-8.0 GHz

MAAPGM0074-DIE 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:0.197 X 0.250 INCH, 0.003 INCH HEIGHT, HERMETIC SEALED, DIEReach Compliance Code:unknown
风险等级:5.8Is Samacsys:N
Base Number Matches:1

MAAPGM0074-DIE 数据手册

 浏览型号MAAPGM0074-DIE的Datasheet PDF文件第2页浏览型号MAAPGM0074-DIE的Datasheet PDF文件第3页浏览型号MAAPGM0074-DIE的Datasheet PDF文件第4页浏览型号MAAPGM0074-DIE的Datasheet PDF文件第5页浏览型号MAAPGM0074-DIE的Datasheet PDF文件第6页浏览型号MAAPGM0074-DIE的Datasheet PDF文件第7页 
MAAP-000074-PED000  
Amplifier, Power, 8W  
2.0-8.0 GHz  
Rev —  
Preliminary Datasheet  
Features  
8 Watt Saturated Output Power Level  
Eutectically mounted to Heat Spreader  
Next level integration is a Silver Epoxy-Based Process  
Variable Drain Voltage (6-10V) Operation  
MSAG™ Process  
Description  
The MAAP-000074-PED000 is a 2-stage 8W power amplifier with on-chip bias net-  
works, eutettically mounted on a 10-mil thick Copper Molybdenum (CuMo) pedes-  
tal. This product is fully matched to 50 ohms on both the input and output. It can be  
used as a power amplifier stage or as a driver stage in high power applications.  
Fabricated using M/A-COM’s repeatable, high performance and highly reliable  
GaAs Multifunction Self-Aligned Gate (MSAG™)Process, each device is 100% RF  
tested at the die-on-pedestal assembly level to ensure performance compliance.  
Primary Applications  
SatCom  
Radio Communications  
Radar  
M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes,  
planar processing of ion implanted transistors, multiple implant capability enabling  
power, low-noise, switch and digital FETs on a single chip, and polyimide scratch  
protection for ease of use with automated manufacturing processes. The use of  
refractory metals and the absence of platinum in the gate metal formulation pre-  
vents hydrogen poisoning when employed in hermetic packaging.  
Electronic Warfare  
Also Available in:  
Description  
Die  
Ceramic Package  
Sample Board (Die)  
Sample Board (Pkg)  
Mechanical Sample (Die)  
Part Number  
MAAPGM0074-DIE MAAP-000074-PKG001 MAAP-000074-SMB004 MAAP-000074-SMB001 MAAP-000074-MCH000  
Electrical Characteristics: TB = 30°C1, Z0 = 50 Ω, VDD = 10V, IDQ = 2.1A2, Pin = 28 dBm, RG=40 Ω  
Parameter  
Symbol  
Typical  
2.0-8.0  
39  
Units  
GHz  
dBm  
dBm  
dB  
Bandwidth  
f
Output Power  
POUT  
P1dB  
1-dB Compression Point  
Small Signal Gain  
Input VSWR  
38  
14  
G
VSWR  
1.7:1  
2.2:1  
Output VSWR  
VSWR  
IGG  
Gate Current  
3.5  
mA  
Drain Current  
2nd Harmonic, 2-4 GHz  
3.5  
16.5  
72  
A
IDD  
2f  
dBc  
dBc  
2nd Harmonic, 6-8 GHz  
2f  
1. TB = MMIC Base Temperature  
2. Adjust VGG between –2.6 and –1.5V to achieve specified IDQ  
.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  

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