Datasheet > MA001398098

MA001398098

更新时间： 2024-11-25 00:58:47

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英飞凌 - INFINEON		/
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1页	33K
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Material Content Data Sheet

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MA001398098 数据手册

Material Content Data Sheet

Sales Product Name BSC027N04LS G

Issued

5. December 2014

120.88 mg

MA#

MA001255716

PG-TDSON-8-1

Package

Weight*

Average

Mass

[%]

Average

Sum

CAS#

Weight

[mg]

Sum

Construction Element

Material Group

Substances

Mass

[%]

[ppm]

if applicable

[ppm]

19782

313

chip

inorganic material

non noble metal

inorganic material

non noble metal

organic material

plastics

silicon

7440-21-3

7439-89-6

7723-14-0

7440-50-8

1333-86-4

2.391

0.038

0.011

37.762

0.042

0.084

5.935

35.777

1.452

0.166

0.057

0.046

2.173

1.289

0.011

0.003

11.320

0.022

0.007

22.292

1.98

0.03

0.01

31.23

0.03

0.07

4.91

29.60

1.20

0.14

0.05

0.04

1.80

1.07

0.01

0.00

9.36

0.02

0.01

18.44

1.98

19782

leadframe

iron

phosphorus

copper

carbon black

epoxy resin

silicondioxide

tin

31.27

0.03

312398

344

312805

344

wire

encapsulation

692

49100

295980

12009

1369

471

inorganic material

non noble metal

noble metal

60676-86-0

7440-31-5

7440-22-4

7440-31-5

7439-92-1

7440-22-4

7439-89-6

7723-14-0

7440-50-8

7439-89-6

7723-14-0

7440-50-8

34.58

1.20

0.14

345772

12009

1369

leadfinish

plating

silver

solder

noble metal

silver

non noble metal

noble metal

tin

376

lead

1.89

1.07

17977

10668

18824

10668

CLIP plating

heatspreader

silver

non noble metal

inorganic material

non noble metal

inorganic material

non noble metal

< 10%

iron

phosphorus

copper

iron

9.37

93649

185

93771

heat sink CLIP

*deviation

phosphorus

copper

18.47

184416

184656

Sum in total: 100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Address

Internet

Infineon Technologies AG

81726 München

www.infineon.com

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