Material Content Data Sheet
Sales Product Name SPA11N80C3
Issued
21. September 2015
MA#
MA001408794
Package
PG-TO220-3-253
Weight*
2136.05 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
9.366
1.431
0.44
0.07
0.02
66.89
0.14
0.16
6.07
24.91
1.02
0.08
0.02
0.05
0.13
0.44
4385
670
4385
leadframe
iron
phosphorus
copper
0.429
201
1428.770
3.035
66.98
0.14
668883
1421
1557
60716
249090
10173
836
669754
1421
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
3.325
129.692
532.069
21.731
1.786
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
31.14
1.02
0.08
311363
10173
836
leadfinish
plating
nickel
solder
antimony
silver
0.442
207
1.104
517
non noble metal
< 10%
tin
2.870
0.20
1344
2068
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com