Material Content Data Sheet
Sales Product Name IFX25401TEV
Issued
18. August 2015
366.01 mg
MA#
MA001380174
Package
PG-TO252-5-11
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
3.179
0.205
0.061
204.243
0.182
0.296
13.630
134.230
5.136
0.076
0.000
0.119
0.095
4.552
0.87
0.06
0.02
55.81
0.05
0.08
3.72
36.67
1.40
0.02
0.00
0.03
0.03
1.24
0.87
8685
559
8685
leadframe
iron
phosphorus
copper
168
55.89
0.05
558032
499
558760
499
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
810
37241
366742
14032
208
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
40.47
1.40
404793
14032
leadfinish
plating
nickel
phosphorus
silver
0.02
1
208
solder
326
non noble metal
non noble metal
< 10%
tin
260
lead
1.30
12437
13023
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com