Material Content Data Sheet
Sales Product Name IPD60R520C6
Issued
20. April 2015
388.82 mg
MA#
MA001348740
Package
PG-TO252-3-341
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
3.425
0.248
0.88
0.06
0.02
63.82
0.11
0.10
3.02
30.10
0.97
0.13
0.02
0.02
0.75
0.88
8809
639
8809
leadframe
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
0.075
192
248.124
0.429
63.90
0.11
638141
1103
997
638972
1103
wire
encapsulation
0.388
11.755
117.030
3.787
30232
300986
9739
1325
196
inorganic material
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
33.22
0.97
0.13
332215
9739
leadfinish
plating
nickel
0.515
1325
solder
silver
0.076
non noble metal
non noble metal
< 10%
tin
0.061
157
lead
2.910
0.79
7484
7837
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com