是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | TSSOP |
包装说明: | TSSOP, TSSOP20,.25 | 针数: | 20 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.73 | 系列: | HC/UH |
JESD-30 代码: | R-PDSO-G20 | JESD-609代码: | e0 |
长度: | 6.5 mm | 负载电容(CL): | 50 pF |
逻辑集成电路类型: | MULTIPLEXER | 最大I(ol): | 0.006 A |
功能数量: | 1 | 输入次数: | 8 |
输出次数: | 1 | 端子数量: | 20 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出特性: | 3-STATE | 输出极性: | COMPLEMENTARY |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP20,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法: | TAPE AND REEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2/6 V |
Prop。Delay @ Nom-Sup: | 78 ns | 传播延迟(tpd): | 420 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Multiplexer/Demultiplexers | 最大供电电压 (Vsup): | 6 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 4.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4.4 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M74HC365 | STMICROELECTRONICS |
获取价格 |
HEX BUS BUFFER 3-STATE HC365 NON INVERTING- HC366 INVERTING | |
M74HC365_01 | STMICROELECTRONICS |
获取价格 |
HEX BUS BUFFER WITH 3 STATE OUTPUTS (NON INVERTING) | |
M74HC365B1R | STMICROELECTRONICS |
获取价格 |
HEX BUS BUFFER 3-STATE HC365 NON INVERTING- HC366 INVERTING | |
M74HC365C1 | STMICROELECTRONICS |
获取价格 |
HC/UH SERIES, 6-BIT DRIVER, TRUE OUTPUT, PQCC20, PLASTIC, CC-20 | |
M74HC365C1R | STMICROELECTRONICS |
获取价格 |
HEX BUS BUFFER 3-STATE HC365 NON INVERTING- HC366 INVERTING | |
M74HC365DP | MITSUBISHI |
获取价格 |
Bus Driver, 1-Func, 6-Bit, True Output, CMOS, PDSO16 | |
M74HC365F1 | STMICROELECTRONICS |
获取价格 |
暂无描述 | |
M74HC365F1R | STMICROELECTRONICS |
获取价格 |
HEX BUS BUFFER 3-STATE HC365 NON INVERTING- HC366 INVERTING | |
M74HC365FP | MITSUBISHI |
获取价格 |
Bus Driver, 1-Func, 6-Bit, True Output, CMOS, PDSO16 | |
M74HC365M1 | STMICROELECTRONICS |
获取价格 |
暂无描述 |