是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, BGA72(UNSPEC) |
针数: | 72 | Reach Compliance Code: | unknown |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.92 |
Is Samacsys: | N | 最长访问时间: | 90 ns |
其他特性: | COMBINATION OF 3.3V FLASH MEM & SRAM IN -CSP; ACCESS TIME FOR FLASH MEM IS 90NS & FOR SRAM 85 NS | JESD-30 代码: | R-PBGA-B72 |
JESD-609代码: | e0 | 内存密度: | 16777216 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 16 |
混合内存类型: | FLASH+SRAM | 功能数量: | 1 |
端子数量: | 72 | 字数: | 1048576 words |
字数代码: | 1000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 1MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA72(UNSPEC) |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3/3.3 V |
认证状态: | Not Qualified | 子类别: | Other Memory ICs |
最大压摆率: | 0.07 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M6MGB166S4BWG-85 | MITSUBISHI |
获取价格 |
Memory Circuit, 1MX16, CMOS, PBGA72, 0.80 MM PITCH, CSP-72 | |
M6MGB166S4BWG-90 | MITSUBISHI |
获取价格 |
Memory Circuit, 1MX16, CMOS, PBGA72, 0.80 MM PITCH, CSP-72 | |
M6MGB331S4BKT | RENESAS |
获取价格 |
33,554,432-BIT (2,097,152 - WORD BY 16-BIT/4,194,304-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH M | |
M6MGB331S8AKT | RENESAS |
获取价格 |
33,554,432-BIT (2,097,152 - WORD BY 16-BIT /4,194,304-WORD BY 8-BIT) CMOS FLASH MEMORY & 8 | |
M6MGB331S8BKT | RENESAS |
获取价格 |
33,554,432-BIT (2,097,152 - WORD BY 16-BIT /4,194,304-WORD BY 8-BIT) CMOS FLASH MEMORY & 8 | |
M6MGB641S8AKT | RENESAS |
获取价格 |
M6MGB641S8AKT | |
M6MGB647M17AKT | RENESAS |
获取价格 |
M6MGB647M17AKT | |
M6MGB647M34CKT | RENESAS |
获取价格 |
M6MGB647M34CKT | |
M6MGB64BM17AWG | RENESAS |
获取价格 |
M6MGB64BM17AWG | |
M6MGB64BM34CWG | RENESAS |
获取价格 |
M6MGB64BM34CWG |